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KayPwodwi yoSikit entegre Integrated (ICs)Embedded - Sistèm sou Chip (SoC)XC7Z030-1FFG676C
XC7Z030-1FFG676C Image
Imaj ka reprezantasyon.
wè espesifikasyon pou detay pwodwi.
EKSPRIME OPSYON
Metòd Peman

XC7Z030-1FFG676C - AMD

Manifakti Nimewo Pati
XC7Z030-1FFG676C
Manifakti
AMD Xilinx
Allelco Nimewo Pati
32D-XC7Z030-1FFG676C
ECAD modèl
Pati Deskripsyon
IC SOC CORTEX-A9 667MHZ 676FCBGA
Pake
676-BBGA, FCBGA
Done fèy
XC7Z030-1FFG676C.pdf
RoHs Status
Sètifikasyon nou an
Nan stok: 115

Jaden obligatwa yo endike pa yon asterisk (*)
Tanpri voye RFQ, nou pral reponn imedyatman.

Kantite
EKSPRIME OPSYON
Metòd Peman
Sètifikasyon nou an

Espesifikasyon

Espesifikasyon XC7Z030-1FFG676C Tech
AMD - XC7Z030-1FFG676C espesifikasyon teknik, atribi, paramèt ak pati ki gen espesifikasyon menm jan ak AMD - XC7Z030-1FFG676C

Pwodwi atribi Valè atribi  
Manifakti AMD Xilinx  
Founisè Aparèy pake 676-FCBGA (27x27)  
Vitès 667MHz  
Seri Zynq®-7000  
RAM gwosè 256KB  
Prensipal atribi Kintex™-7 FPGA, 125K Logic Cells  
Periferik DMA  
Pake / Ka 676-BBGA, FCBGA  
Pwodwi atribi Valè atribi  
Pakèt Tray  
Operating Tanperati 0°C ~ 85°C (TJ)  
Kantite I / O 130  
Flash Size -  
Nwayo Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™  
Koneksyon CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG  
Nimewo pwodwi baz XC7Z030  
Achitekti MCU, FPGA  

Anviwònman & ekspòtasyon klasifikasyon

ATRIBI DESKRIPSYON
RoHs Status
Nivo sansiblite imidite (MSL) 4 (72 Hours)
Rive nan estati REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001

Pati ki gen espesifikasyon menm jan an

Twa pati ki sou bò dwat la gen menm espesifikasyon pou AMD XC7Z030-1FFG676C.

Pwodwi atribi XC7Z030-1FFG676C XC7Z030-2FBG676E XC7Z030-1FBG676I XC7Z030-1FBG676C
Nimewo Pati XC7Z030-1FFG676C XC7Z030-2FBG676E XC7Z030-1FBG676I XC7Z030-1FBG676C
Manifakti AMD AMD AMD AMD
Flash Size - - - -
Kantite I / O 130 130 130 130
Periferik DMA DMA DMA DMA
Koneksyon CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Nwayo Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Vitès 667MHz 800MHz 667MHz 667MHz
Pakèt Tray Tray Tray Tray
Founisè Aparèy pake 676-FCBGA (27x27) 676-FCBGA (27x27) 676-FCBGA (27x27) 676-FCBGA (27x27)
Seri Zynq®-7000 Zynq®-7000 Zynq®-7000 Zynq®-7000
Achitekti MCU, FPGA MCU, FPGA MCU, FPGA MCU, FPGA
Pake / Ka 676-BBGA, FCBGA 676-BBGA, FCBGA 676-BBGA, FCBGA 676-BBGA, FCBGA
Operating Tanperati 0°C ~ 85°C (TJ) 0°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) 0°C ~ 85°C (TJ)
Prensipal atribi Kintex™-7 FPGA, 125K Logic Cells Kintex™-7 FPGA, 125K Logic Cells Kintex™-7 FPGA, 125K Logic Cells Kintex™-7 FPGA, 125K Logic Cells
RAM gwosè 256KB 256KB 256KB 256KB
Nimewo pwodwi baz XC7Z030 XC7Z030 XC7Z030 XC7Z030

XC7Z030-1FFG676C fich PDF

Download XC7Z030-1FFG676C PDF fich ak dokiman AMD pou XC7Z030-1FFG676C - AMD.

Enfòmasyon sou anviwònman an
Xilinx REACH211 Cert.pdf
PCN konsepsyon/spesifikasyon
Mult Dev Material Chg 16/Dec/2019.pdf Cross-Ship Lead-Free Notice 31/Oct/2016.pdf

Shipment

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XC7Z030-1FFG676C Image

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32D-XC7Z030-1FFG676C

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