Tanpri, al gade nan vèsyon an angle kòm vèsyon ofisyèl nou an.

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Kay Pwodwi yo Sikit entegre Integrated (ICs)Embedded - mikrokontwolè~~PK30X256VMD100~~

Imaj ka reprezantasyon.
wè espesifikasyon pou detay pwodwi.

~~Favori~~

EKSPRIME OPSYON

Metòd Peman

PK30X256VMD100 - NXP USA Inc.

Name: NXP USA Inc. PK30X256VMD100
Brand: NXP USA Inc.
SKU: PK30X256VMD100
Availability: InStock
Rating: 5 (6 reviews)

Manifakti Nimewo Pati: PK30X256VMD100

Manifakti: NXP Semiconductors

Allelco Nimewo Pati: 32D-PK30X256VMD100

ECAD modèl

Pati Deskripsyon: IC MCU 32B 256KB FLASH 144MAPBGA

Pake: 144-LBGA

Done fèy: ~~PK30X256VMD100.pdf~~

RoHs Status

~~Konpare~~

Sètifikasyon nou an

Nan stok: 11750

EKSPRIME OPSYON

Metòd Peman

Sètifikasyon nou an

Espesifikasyon

Espesifikasyon PK30X256VMD100 Tech
NXP USA Inc. - PK30X256VMD100 espesifikasyon teknik, atribi, paramèt ak pati ki gen espesifikasyon menm jan ak NXP USA Inc. - PK30X256VMD100

Pwodwi atribi	Valè atribi
Manifakti	NXP Semiconductors
Voltage - Pwovizyon pou (Vcc / Vdd)	1.71V ~ 3.6V
Founisè Aparèy pake	144-MAPBGA (13x13)
Vitès	100MHz
Seri	Kinetis K30
RAM gwosè	64K x 8
Kalite Memory Type	FLASH
Pwogram memwa gwosè	256KB (256K x 8)
Periferik	DMA, I²S, LCD, LVD, POR, PWM, WDT
Pake / Ka	144-LBGA
Pakèt	Tray

Pwodwi atribi	Valè atribi
Kalite Oscillator	Internal
Operating Tanperati	-40°C ~ 105°C (TA)
Kantite I / O	102
Mounting Kalite	Surface Mount
EEPROM Size	4K x 8
Done konnvètè yo	A/D 31x16b; D/A 2x12b
Nwayo gwosè	32-Bit Single-Core
Nwayo Processor	ARM® Cortex®-M4
Koneksyon	CANbus, EBI/EMI, I²C, IrDA, SD, SPI, UART/USART
Nimewo pwodwi baz	PK30

Anviwònman & ekspòtasyon klasifikasyon

ATRIBI	DESKRIPSYON
RoHs Status
Nivo sansiblite imidite (MSL)	3 (168 Hours)
Rive nan estati	REACH Unaffected
ECCN	3A991A2
HTSUS	8542.31.0001

Pati ki gen espesifikasyon menm jan an

Twa pati ki sou bò dwat la gen menm espesifikasyon pou NXP USA Inc. PK30X256VMD100.

Pwodwi atribi
Nimewo Pati	PK30X256VMD100	PK30X256VMD100	PIC16LF1847-I/SO	PIC16C715-04/SO
Manifakti	NXP USA Inc.	Freescale Semiconductor	Microchip Technology	Microchip Technology
Pwogram memwa gwosè	256KB (256K x 8)	256KB (256K x 8)	14KB (8K x 14)	3.5KB (2K x 14)
Seri	Kinetis K30	Kinetis K30	PIC® XLP™ mTouch™ 16F	PIC® 16C
Nwayo gwosè	32-Bit Single-Core	32-Bit Single-Core	8-Bit	8-Bit
Koneksyon	CANbus, EBI/EMI, I²C, IrDA, SD, SPI, UART/USART	CANbus, EBI/EMI, I²C, IrDA, SD, SPI, UART/USART	I²C, LINbus, SPI, UART/USART	-
Kalite Oscillator	Internal	Internal	Internal	External
RAM gwosè	64K x 8	64K x 8	1K x 8	128 x 8
Founisè Aparèy pake	144-MAPBGA (13x13)	144-MAPBGA (13x13)	18-SOIC	18-SOIC
Periferik	DMA, I²S, LCD, LVD, POR, PWM, WDT	DMA, I²S, LCD, LVD, POR, PWM, WDT	Brown-out Detect/Reset, POR, PWM, WDT	Brown-out Detect/Reset, POR, WDT
Kalite Memory Type	FLASH	FLASH	FLASH	OTP
Kantite I / O	102	102	15	13
Done konnvètè yo	A/D 31x16b; D/A 2x12b	A/D 31x16b; D/A 2x12b	A/D 12x10b	A/D 4x8b
Pake / Ka	144-LBGA	144-LBGA	18-SOIC (0.295', 7.50mm Width)	18-SOIC (0.295', 7.50mm Width)
Pakèt	Tray	Bulk	Tube	Tube
Voltage - Pwovizyon pou (Vcc / Vdd)	1.71V ~ 3.6V	1.71V ~ 3.6V	1.8V ~ 3.6V	4V ~ 5.5V
Mounting Kalite	Surface Mount	Surface Mount	Surface Mount	Surface Mount
Nwayo Processor	ARM® Cortex®-M4	ARM® Cortex®-M4	PIC	PIC
Operating Tanperati	-40°C ~ 105°C (TA)	-40°C ~ 105°C (TA)	-40°C ~ 85°C (TA)	0°C ~ 70°C (TA)
EEPROM Size	4K x 8	4K x 8	256 x 8	-
Vitès	100MHz	100MHz	32MHz	4MHz
Nimewo pwodwi baz	PK30	PK30	PIC16LF1847	PIC16C715

PK30X256VMD100 fich PDF

Download PK30X256VMD100 PDF fich ak dokiman NXP USA Inc. pou PK30X256VMD100 - NXP USA Inc..

PCN anbalaj: 2.73KHz.pdf
Enfòmasyon sou anviwònman an: NXP USA Inc REACH.pdf NXP USA Inc RoHS Cert.pdf

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Lazi	Peyi pwovizwa	4
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Chajman chaj (kg)	Referans DHL (USD $)
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2.00kg-3.00kg	USD $ 50.00 - USD $ 100.00

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Sètifikasyon & Manm

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PK30X256VMD100

NXP USA Inc.
32D-PK30X256VMD100

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