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KayPwodwi yoSikit entegre Integrated (ICs)Embedded - Sistèm sou Chip (SoC)XC7Z007S-1CLG225I
XC7Z007S-1CLG225I Image
Imaj ka reprezantasyon.
wè espesifikasyon pou detay pwodwi.

XC7Z007S-1CLG225I - AMD

Manifakti Nimewo Pati
XC7Z007S-1CLG225I
Manifakti
AMD Xilinx
Allelco Nimewo Pati
32D-XC7Z007S-1CLG225I
ECAD modèl
Pati Deskripsyon
IC SOC CORTEX-A9 667MHZ 225BGA
Deskripsyon detaye
Pake
225-LFBGA, CSPBGA
Done fèy
XC7Z007S-1CLG225I.pdf
RoHs Status
Nan stok: 567

Jaden obligatwa yo endike pa yon asterisk (*)
Tanpri voye RFQ, nou pral reponn imedyatman.

Kantite

Espesifikasyon

Espesifikasyon XC7Z007S-1CLG225I Tech
AMD - XC7Z007S-1CLG225I espesifikasyon teknik, atribi, paramèt ak pati ki gen espesifikasyon menm jan ak AMD - XC7Z007S-1CLG225I

Pwodwi atribi Valè atribi  
Manifakti AMD Xilinx  
Founisè Aparèy pake 225-CSPBGA (13x13)  
Vitès 667MHz  
Seri Zynq®-7000  
RAM gwosè 256KB  
Prensipal atribi Artix™-7 FPGA, 23K Logic Cells  
Periferik DMA  
Pake / Ka 225-LFBGA, CSPBGA  
Pwodwi atribi Valè atribi  
Pakèt Tray  
Operating Tanperati -40°C ~ 100°C (TJ)  
Kantite I / O 54  
Flash Size -  
Nwayo Processor Single ARM® Cortex®-A9 MPCore™ with CoreSight™  
Koneksyon CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG  
Nimewo pwodwi baz XC7Z007  
Achitekti MCU, FPGA  

Pati ki gen espesifikasyon menm jan an

Twa pati ki sou bò dwat la gen menm espesifikasyon pou AMD XC7Z007S-1CLG225I.

Pwodwi atribi XC7Z007S-1CLG225I XC7Z010-1CLG225C XC7Z007S-2CLG225E XC7Z010-1CLG225I
Nimewo Pati XC7Z007S-1CLG225I XC7Z010-1CLG225C XC7Z007S-2CLG225E XC7Z010-1CLG225I
Manifakti AMD AMD AMD AMD
Prensipal atribi Artix™-7 FPGA, 23K Logic Cells Artix™-7 FPGA, 28K Logic Cells Artix™-7 FPGA, 23K Logic Cells Artix™-7 FPGA, 28K Logic Cells
Pakèt Tray Tray Tray Tray
Achitekti MCU, FPGA MCU, FPGA MCU, FPGA MCU, FPGA
Flash Size - - - -
Nimewo pwodwi baz XC7Z007 XC7Z010 XC7Z007 XC7Z010
Seri Zynq®-7000 Zynq®-7000 Zynq®-7000 Zynq®-7000
Nwayo Processor Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Vitès 667MHz 667MHz 766MHz 667MHz
Koneksyon CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Kantite I / O 54 86 54 86
Periferik DMA DMA DMA DMA
Operating Tanperati -40°C ~ 100°C (TJ) 0°C ~ 85°C (TJ) 0°C ~ 100°C (TJ) -40°C ~ 100°C (TJ)
RAM gwosè 256KB 256KB 256KB 256KB
Pake / Ka 225-LFBGA, CSPBGA 225-LFBGA, CSPBGA 225-LFBGA, CSPBGA 225-LFBGA, CSPBGA
Founisè Aparèy pake 225-CSPBGA (13x13) 225-CSPBGA (13x13) 225-CSPBGA (13x13) 225-CSPBGA (13x13)

XC7Z007S-1CLG225I fich PDF

Download XC7Z007S-1CLG225I PDF fich ak dokiman AMD pou XC7Z007S-1CLG225I - AMD.

Enfòmasyon sou anviwònman an
Xilinx REACH211 Cert.pdf

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XC7Z007S-1CLG225I Image

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32D-XC7Z007S-1CLG225I

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