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KayPwodwi yoSikit entegre Integrated (ICs)Embedded - Sistèm sou Chip (SoC)XCZU19EG-1FFVB1517E
XCZU19EG-1FFVB1517E Image
Imaj ka reprezantasyon.
wè espesifikasyon pou detay pwodwi.

XCZU19EG-1FFVB1517E - AMD

Manifakti Nimewo Pati
XCZU19EG-1FFVB1517E
Manifakti
AMD Xilinx
Allelco Nimewo Pati
32D-XCZU19EG-1FFVB1517E
ECAD modèl
Pati Deskripsyon
IC SOC CORTEX-A53 1517FCBGA
Deskripsyon detaye
Pake
1517-BBGA, FCBGA
Done fèy
XCZU19EG-1FFVB1517E.pdf
RoHs Status
Nan stok: 8

Jaden obligatwa yo endike pa yon asterisk (*)
Tanpri voye RFQ, nou pral reponn imedyatman.

Kantite

Espesifikasyon

Espesifikasyon XCZU19EG-1FFVB1517E Tech
AMD - XCZU19EG-1FFVB1517E espesifikasyon teknik, atribi, paramèt ak pati ki gen espesifikasyon menm jan ak AMD - XCZU19EG-1FFVB1517E

Pwodwi atribi Valè atribi  
Manifakti AMD Xilinx  
Founisè Aparèy pake 1517-FCBGA (40x40)  
Vitès 500MHz, 600MHz, 1.2GHz  
Seri Zynq® UltraScale+™ MPSoC EG  
RAM gwosè 256KB  
Prensipal atribi Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells  
Periferik DMA, WDT  
Pake / Ka 1517-BBGA, FCBGA  
Pwodwi atribi Valè atribi  
Pakèt Tray  
Operating Tanperati 0°C ~ 100°C (TJ)  
Kantite I / O 644  
Flash Size -  
Nwayo Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2  
Koneksyon CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG  
Nimewo pwodwi baz XCZU19  
Achitekti MCU, FPGA  

Pati ki gen espesifikasyon menm jan an

Twa pati ki sou bò dwat la gen menm espesifikasyon pou AMD XCZU19EG-1FFVB1517E.

Pwodwi atribi XCZU19EG-1FFVB1517E XCZU19EG-1FFVC1760E XCZU19EG-2FFVB1517I XCZU17EG-1FFVB1517E
Nimewo Pati XCZU19EG-1FFVB1517E XCZU19EG-1FFVC1760E XCZU19EG-2FFVB1517I XCZU17EG-1FFVB1517E
Manifakti AMD AMD AMD AMD
Operating Tanperati 0°C ~ 100°C (TJ) 0°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) 0°C ~ 100°C (TJ)
Seri Zynq® UltraScale+™ MPSoC EG Zynq® UltraScale+™ MPSoC EG Zynq® UltraScale+™ MPSoC EG Zynq® UltraScale+™ MPSoC EG
Periferik DMA, WDT DMA, WDT DMA, WDT DMA, WDT
Pake / Ka 1517-BBGA, FCBGA 1760-BBGA, FCBGA 1517-BBGA, FCBGA 1517-BBGA, FCBGA
Kantite I / O 644 512 644 644
Nimewo pwodwi baz XCZU19 XCZU19 XCZU19 XCZU17
Koneksyon CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Founisè Aparèy pake 1517-FCBGA (40x40) 1760-FCBGA (42.5x42.5) 1517-FCBGA (40x40) 1517-FCBGA (40x40)
Nwayo Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Pakèt Tray Tray Tray Tray
Flash Size - - - -
Prensipal atribi Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Zynq®UltraScale+™ FPGA, 926K+ Logic Cells
Achitekti MCU, FPGA MCU, FPGA MCU, FPGA MCU, FPGA
RAM gwosè 256KB 256KB 256KB 256KB
Vitès 500MHz, 600MHz, 1.2GHz 500MHz, 600MHz, 1.2GHz 533MHz, 600MHz, 1.3GHz 500MHz, 600MHz, 1.2GHz

Shipment

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Metòd livrezon

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Sètifikasyon & Manm

Wè plis
XCZU19EG-1FFVB1517E Image

XCZU19EG-1FFVB1517E

AMD
32D-XCZU19EG-1FFVB1517E

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