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KayPwodwi yoSikit entegre Integrated (ICs)Embedded - Sistèm sou Chip (SoC)XCZU2CG-L1SFVC784I
XCZU2CG-L1SFVC784I Image
Imaj ka reprezantasyon.
wè espesifikasyon pou detay pwodwi.
EKSPRIME OPSYON
Metòd Peman

XCZU2CG-L1SFVC784I - AMD

Manifakti Nimewo Pati
XCZU2CG-L1SFVC784I
Manifakti
AMD Xilinx
Allelco Nimewo Pati
32D-XCZU2CG-L1SFVC784I
ECAD modèl
Pati Deskripsyon
IC SOC CORTEX-A53 784FCBGA
Pake
784-BFBGA, FCBGA
Done fèy
XCZU2CG-L1SFVC784I.pdf
RoHs Status
Sètifikasyon nou an
Nan stok: 80

Jaden obligatwa yo endike pa yon asterisk (*)
Tanpri voye RFQ, nou pral reponn imedyatman.

Kantite
EKSPRIME OPSYON
Metòd Peman
Sètifikasyon nou an

Espesifikasyon

Espesifikasyon XCZU2CG-L1SFVC784I Tech
AMD - XCZU2CG-L1SFVC784I espesifikasyon teknik, atribi, paramèt ak pati ki gen espesifikasyon menm jan ak AMD - XCZU2CG-L1SFVC784I

Pwodwi atribi Valè atribi  
Manifakti AMD Xilinx  
Founisè Aparèy pake 784-FCBGA (23x23)  
Vitès 500MHz, 1.2GHz  
Seri Zynq® UltraScale+™ MPSoC CG  
RAM gwosè 256KB  
Prensipal atribi Zynq®UltraScale+™ FPGA, 103K+ Logic Cells  
Periferik DMA, WDT  
Pake / Ka 784-BFBGA, FCBGA  
Pwodwi atribi Valè atribi  
Pakèt Tray  
Operating Tanperati -40°C ~ 100°C (TJ)  
Kantite I / O 252  
Flash Size -  
Nwayo Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™  
Koneksyon CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG  
Nimewo pwodwi baz XCZU2  
Achitekti MCU, FPGA  

Anviwònman & ekspòtasyon klasifikasyon

ATRIBI DESKRIPSYON
RoHs Status
Nivo sansiblite imidite (MSL) 4 (72 Hours)
Rive nan estati REACH Unaffected
ECCN 5A002A4 XIL
HTSUS 8542.39.0001

Pati ki gen espesifikasyon menm jan an

Twa pati ki sou bò dwat la gen menm espesifikasyon pou AMD XCZU2CG-L1SFVC784I.

Pwodwi atribi XCZU2CG-L1SFVC784I XCZU2CG-1SBVA484I XCZU2EG-2SFVC784I XCZU2CG-1SFVC784E
Nimewo Pati XCZU2CG-L1SFVC784I XCZU2CG-1SBVA484I XCZU2EG-2SFVC784I XCZU2CG-1SFVC784E
Manifakti AMD AMD AMD AMD
Koneksyon CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Achitekti MCU, FPGA MCU, FPGA MCU, FPGA MCU, FPGA
Nwayo Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
RAM gwosè 256KB 256KB 256KB 256KB
Vitès 500MHz, 1.2GHz 500MHz, 1.2GHz 533MHz, 600MHz, 1.3GHz 500MHz, 1.2GHz
Periferik DMA, WDT DMA, WDT DMA, WDT DMA, WDT
Seri Zynq® UltraScale+™ MPSoC CG Zynq® UltraScale+™ MPSoC CG Zynq® UltraScale+™ MPSoC EG Zynq® UltraScale+™ MPSoC CG
Prensipal atribi Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Operating Tanperati -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) 0°C ~ 100°C (TJ)
Pakèt Tray Tray Tray Tray
Nimewo pwodwi baz XCZU2 XCZU2 XCZU2 XCZU2
Pake / Ka 784-BFBGA, FCBGA 484-BFBGA, FCBGA 784-BFBGA, FCBGA 784-BFBGA, FCBGA
Kantite I / O 252 82 252 252
Flash Size - - - -
Founisè Aparèy pake 784-FCBGA (23x23) 484-FCBGA (19x19) 784-FCBGA (23x23) 784-FCBGA (23x23)

XCZU2CG-L1SFVC784I fich PDF

Download XCZU2CG-L1SFVC784I PDF fich ak dokiman AMD pou XCZU2CG-L1SFVC784I - AMD.

Enfòmasyon sou anviwònman an
Xilinx REACH211 Cert.pdf

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XCZU2CG-L1SFVC784I Image

XCZU2CG-L1SFVC784I

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32D-XCZU2CG-L1SFVC784I

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