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KayPwodwi yoSikit entegre Integrated (ICs)Embedded - Sistèm sou Chip (SoC)XCZU3EG-2SFVA625I
XCZU3EG-2SFVA625I Image
Imaj ka reprezantasyon.
wè espesifikasyon pou detay pwodwi.
EKSPRIME OPSYON
Metòd Peman

XCZU3EG-2SFVA625I - AMD

Manifakti Nimewo Pati
XCZU3EG-2SFVA625I
Manifakti
AMD Xilinx
Allelco Nimewo Pati
32D-XCZU3EG-2SFVA625I
ECAD modèl
Pati Deskripsyon
IC SOC CORTEX-A53 625FCBGA
Pake
625-BFBGA, FCBGA
Done fèy
Zynq UltraScale+ MPSoC Overview.pdf
RoHs Status
Sètifikasyon nou an
Nan stok: 43

Jaden obligatwa yo endike pa yon asterisk (*)
Tanpri voye RFQ, nou pral reponn imedyatman.

Kantite
EKSPRIME OPSYON
Metòd Peman
Sètifikasyon nou an

Espesifikasyon

Espesifikasyon XCZU3EG-2SFVA625I Tech
AMD - XCZU3EG-2SFVA625I espesifikasyon teknik, atribi, paramèt ak pati ki gen espesifikasyon menm jan ak AMD - XCZU3EG-2SFVA625I

Pwodwi atribi Valè atribi  
Manifakti AMD Xilinx  
Founisè Aparèy pake 625-FCBGA (21x21)  
Vitès 533MHz, 600MHz, 1.3GHz  
Seri Zynq® UltraScale+™ MPSoC EG  
RAM gwosè 256KB  
Prensipal atribi Zynq®UltraScale+™ FPGA, 154K+ Logic Cells  
Periferik DMA, WDT  
Pake / Ka 625-BFBGA, FCBGA  
Pwodwi atribi Valè atribi  
Pakèt Tray  
Operating Tanperati -40°C ~ 100°C (TJ)  
Kantite I / O 180  
Flash Size -  
Nwayo Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2  
Koneksyon CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG  
Nimewo pwodwi baz XCZU3  
Achitekti MCU, FPGA  

Anviwònman & ekspòtasyon klasifikasyon

ATRIBI DESKRIPSYON
RoHs Status
Nivo sansiblite imidite (MSL) 4 (72 Hours)
Rive nan estati REACH Unaffected
ECCN 5A002A4 XIL
HTSUS 8542.39.0001

Pati ki gen espesifikasyon menm jan an

Twa pati ki sou bò dwat la gen menm espesifikasyon pou AMD XCZU3EG-2SFVA625I.

Pwodwi atribi XCZU3EG-2SFVA625I XCZU47DR-2FFVG1517I XCZU3EG-1SFVA625I XCZU3EG-2SFVA625E
Nimewo Pati XCZU3EG-2SFVA625I XCZU47DR-2FFVG1517I XCZU3EG-1SFVA625I XCZU3EG-2SFVA625E
Manifakti AMD AMD AMD AMD
Koneksyon CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Flash Size - - - -
Nwayo Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Achitekti MCU, FPGA MCU, FPGA MCU, FPGA MCU, FPGA
Nimewo pwodwi baz XCZU3 - XCZU3 XCZU3
RAM gwosè 256KB 256KB 256KB 256KB
Pake / Ka 625-BFBGA, FCBGA 1517-BBGA, FCBGA 625-BFBGA, FCBGA 625-BFBGA, FCBGA
Founisè Aparèy pake 625-FCBGA (21x21) 1517-FCBGA (40x40) 625-FCBGA (21x21) 625-FCBGA (21x21)
Seri Zynq® UltraScale+™ MPSoC EG Zynq® UltraScale+™ RFSoC Zynq® UltraScale+™ MPSoC EG Zynq® UltraScale+™ MPSoC EG
Pakèt Tray Tray Tray Tray
Operating Tanperati -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) 0°C ~ 100°C (TJ)
Periferik DMA, WDT DMA, WDT DMA, WDT DMA, WDT
Vitès 533MHz, 600MHz, 1.3GHz 533MHz, 1.333GHz 500MHz, 600MHz, 1.2GHz 533MHz, 600MHz, 1.3GHz
Prensipal atribi Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Kantite I / O 180 561 180 180

XCZU3EG-2SFVA625I fich PDF

Download XCZU3EG-2SFVA625I PDF fich ak dokiman AMD pou XCZU3EG-2SFVA625I - AMD.

Enfòmasyon sou anviwònman an
Xilinx REACH211 Cert.pdf
Html fich
Zynq UltraScale+ MPSoC Overview.pdf

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