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KayPwodwi yoSikit entegre Integrated (ICs)Embedded - Sistèm sou Chip (SoC)XCZU9EG-L1FFVB1156I
XCZU9EG-L1FFVB1156I Image
Imaj ka reprezantasyon.
wè espesifikasyon pou detay pwodwi.
EKSPRIME OPSYON
Metòd Peman

XCZU9EG-L1FFVB1156I - AMD

Manifakti Nimewo Pati
XCZU9EG-L1FFVB1156I
Manifakti
AMD Xilinx
Allelco Nimewo Pati
32D-XCZU9EG-L1FFVB1156I
ECAD modèl
Pati Deskripsyon
IC SOC CORTEX-A53 1156FCBGA
Pake
1156-BBGA, FCBGA
Done fèy
XCZU9EG-L1FFVB1156I.pdf
RoHs Status
Sètifikasyon nou an
Nan stok: 9

Jaden obligatwa yo endike pa yon asterisk (*)
Tanpri voye RFQ, nou pral reponn imedyatman.

Kantite
EKSPRIME OPSYON
Metòd Peman
Sètifikasyon nou an

Espesifikasyon

Espesifikasyon XCZU9EG-L1FFVB1156I Tech
AMD - XCZU9EG-L1FFVB1156I espesifikasyon teknik, atribi, paramèt ak pati ki gen espesifikasyon menm jan ak AMD - XCZU9EG-L1FFVB1156I

Pwodwi atribi Valè atribi  
Manifakti AMD Xilinx  
Founisè Aparèy pake 1156-FCBGA (35x35)  
Vitès 500MHz, 600MHz, 1.2GHz  
Seri Zynq® UltraScale+™ MPSoC EG  
RAM gwosè 256KB  
Prensipal atribi Zynq®UltraScale+™ FPGA, 599K+ Logic Cells  
Periferik DMA, WDT  
Pake / Ka 1156-BBGA, FCBGA  
Pwodwi atribi Valè atribi  
Pakèt Bulk  
Operating Tanperati -40°C ~ 100°C (TJ)  
Kantite I / O 328  
Flash Size -  
Nwayo Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2  
Koneksyon CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG  
Nimewo pwodwi baz XCZU9  
Achitekti MCU, FPGA  

Anviwònman & ekspòtasyon klasifikasyon

ATRIBI DESKRIPSYON
RoHs Status
Nivo sansiblite imidite (MSL) 4 (72 Hours)
Rive nan estati REACH Unaffected
ECCN 5A002A4 XIL
HTSUS 8542.31.0001

Pati ki gen espesifikasyon menm jan an

Twa pati ki sou bò dwat la gen menm espesifikasyon pou AMD XCZU9EG-L1FFVB1156I.

Pwodwi atribi XCZU9EG-L1FFVB1156I XCZU9CG-2FFVB1156I XCZU9EG-2FFVB1156I XCZU9EG-2FFVB1156E
Nimewo Pati XCZU9EG-L1FFVB1156I XCZU9CG-2FFVB1156I XCZU9EG-2FFVB1156I XCZU9EG-2FFVB1156E
Manifakti AMD AMD AMD AMD
Periferik DMA, WDT DMA, WDT DMA, WDT DMA, WDT
Koneksyon CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
RAM gwosè 256KB 256KB 256KB 256KB
Vitès 500MHz, 600MHz, 1.2GHz 533MHz, 1.3GHz 533MHz, 600MHz, 1.3GHz 533MHz, 600MHz, 1.3GHz
Prensipal atribi Zynq®UltraScale+™ FPGA, 599K+ Logic Cells Zynq®UltraScale+™ FPGA, 599K+ Logic Cells Zynq®UltraScale+™ FPGA, 599K+ Logic Cells Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Kantite I / O 328 328 328 328
Nimewo pwodwi baz XCZU9 XCZU9 XCZU9 XCZU9
Nwayo Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Seri Zynq® UltraScale+™ MPSoC EG Zynq® UltraScale+™ MPSoC CG Zynq® UltraScale+™ MPSoC EG Zynq® UltraScale+™ MPSoC EG
Achitekti MCU, FPGA MCU, FPGA MCU, FPGA MCU, FPGA
Pake / Ka 1156-BBGA, FCBGA 1156-BBGA, FCBGA 1156-BBGA, FCBGA 1156-BBGA, FCBGA
Operating Tanperati -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) 0°C ~ 100°C (TJ)
Pakèt Bulk Tray Tray Tray
Founisè Aparèy pake 1156-FCBGA (35x35) 1156-FCBGA (35x35) 1156-FCBGA (35x35) 1156-FCBGA (35x35)
Flash Size - - - -

XCZU9EG-L1FFVB1156I fich PDF

Download XCZU9EG-L1FFVB1156I PDF fich ak dokiman AMD pou XCZU9EG-L1FFVB1156I - AMD.

Enfòmasyon sou anviwònman an
Xilinx REACH211 Cert.pdf

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