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KayPwodwi yoSikit entegre Integrated (ICs)Embedded - mikrokontwolèCY8C6245AZI-S3D12
CY8C6245AZI-S3D12 Image
Imaj ka reprezantasyon.
wè espesifikasyon pou detay pwodwi.

CY8C6245AZI-S3D12 - Infineon Technologies

Manifakti Nimewo Pati
CY8C6245AZI-S3D12
Manifakti
Infineon Technologies
Allelco Nimewo Pati
32D-CY8C6245AZI-S3D12
ECAD modèl
Pati Deskripsyon
IC MCU 32BIT 512KB FLASH 100TQFP
Deskripsyon detaye
Pake
100-LQFP
Done fèy
CY8C62x5.pdf
RoHs Status
Nan stok: 4740

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Espesifikasyon

Espesifikasyon CY8C6245AZI-S3D12 Tech
Infineon Technologies - CY8C6245AZI-S3D12 espesifikasyon teknik, atribi, paramèt ak pati ki gen espesifikasyon menm jan ak Infineon Technologies - CY8C6245AZI-S3D12

Pwodwi atribi Valè atribi  
Manifakti Infineon Technologies  
Voltage - Pwovizyon pou (Vcc / Vdd) 1.7V ~ 3.6V  
Founisè Aparèy pake 100-TQFP (14x14)  
Vitès 100MHz, 150MHz  
Seri PSoC® 6  
RAM gwosè 256 x 8  
Kalite Memory Type FLASH  
Pwogram memwa gwosè 512KB (512K x 8)  
Periferik Bluetooth, Brown-out Detect/Reset, Cap Sense, DMA, LCD, LVD, POR, PWM, SmartSense, WDT  
Pake / Ka 100-LQFP  
Pakèt Tray  
Pwodwi atribi Valè atribi  
Kalite Oscillator External, Internal  
Operating Tanperati -40°C ~ 85°C (TA)  
Kantite I / O 64  
Mounting Kalite Surface Mount  
EEPROM Size -  
Done konnvètè yo A/D 16x12b SAR, 10b Sigma-Delta; D/A 2x7/8b  
Nwayo gwosè 32-Bit Dual-Core  
Nwayo Processor ARM® Cortex®-M0+, ARM® Cortex®-M4F  
Koneksyon FIFO, I²C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SmartCard, SPI, UART/USART, USB  
Nimewo pwodwi baz CY8C6245  

Pati ki gen espesifikasyon menm jan an

Twa pati ki sou bò dwat la gen menm espesifikasyon pou Infineon Technologies CY8C6245AZI-S3D12.

Pwodwi atribi CY8C6245AZI-S3D12 CY8C6247FTI-D52T CY8C5888LTI-LP097 CY8C6247BZI-D44
Nimewo Pati CY8C6245AZI-S3D12 CY8C6247FTI-D52T CY8C5888LTI-LP097 CY8C6247BZI-D44
Manifakti Infineon Technologies Infineon Technologies Infineon Technologies Infineon Technologies
Nimewo pwodwi baz CY8C6245 CY8C6247 CY8C5888 CY8C6247
Seri PSoC® 6 PSoC® 6 PSOC® 5 CY8C58LP PSoC® 6
Pakèt Tray Tape & Reel (TR) Tray Tray
Koneksyon FIFO, I²C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SmartCard, SPI, UART/USART, USB FIFO, I²C, LINbus, QSPI, SPI, UART/USART, USB CANbus, I²C, LINbus, SPI, UART/USART, USB I²C, LINbus, QSPI, SPI, UART/USART, USB
RAM gwosè 256 x 8 288K x 8 64K x 8 288K x 8
Kantite I / O 64 62 38 104
Mounting Kalite Surface Mount Surface Mount Surface Mount Surface Mount
Founisè Aparèy pake 100-TQFP (14x14) 80-WLCSP (3.68x3.19) 68-QFN (8x8) 124-VFBGA (9x9)
EEPROM Size - 32K x 8 2K x 8 32K x 8
Operating Tanperati -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Periferik Bluetooth, Brown-out Detect/Reset, Cap Sense, DMA, LCD, LVD, POR, PWM, SmartSense, WDT Brown-out Detect/Reset, CapSense, DMA, I²S, LCD, POR, PWM, Temp Sensor, WDT CapSense, DMA, LCD, POR, PWM, WDT Brown-out Detect/Reset, Cap Sense, DMA, I²S, POR, PWM, WDT
Pwogram memwa gwosè 512KB (512K x 8) 1MB (1M x 8) 256KB (256K x 8) 1MB (1M x 8)
Done konnvètè yo A/D 16x12b SAR, 10b Sigma-Delta; D/A 2x7/8b A/D 16x12b SAR, 10b Sigma-Delta; D/A 2x7/8b A/D 1x20b, 2x12b; D/A 4x8b A/D 8x12b SAR; D/A 1x12b
Pake / Ka 100-LQFP 80-XFBGA, WLCSP 68-VFQFN Exposed Pad 124-VFBGA
Voltage - Pwovizyon pou (Vcc / Vdd) 1.7V ~ 3.6V 1.71V ~ 3.6V 1.71V ~ 5.5V 1.7V ~ 3.6V
Kalite Oscillator External, Internal External, Internal Internal Internal
Nwayo Processor ARM® Cortex®-M0+, ARM® Cortex®-M4F ARM® Cortex®-M0+, ARM® Cortex®-M4F ARM® Cortex®-M3 ARM® Cortex®-M4/M0
Kalite Memory Type FLASH FLASH FLASH FLASH
Nwayo gwosè 32-Bit Dual-Core 32-Bit Dual-Core 32-Bit Single-Core 32-Bit Dual-Core
Vitès 100MHz, 150MHz 100MHz, 150MHz 80MHz 100MHz, 150MHz

CY8C6245AZI-S3D12 fich PDF

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Fich
CY8C62x5.pdf

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32D-CY8C6245AZI-S3D12

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