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KayPwodwi yoSikit entegre Integrated (ICs)Entèfas - TelecomCYP15G0401DXB-BGC
CYP15G0401DXB-BGC Image
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wè espesifikasyon pou detay pwodwi.
EKSPRIME OPSYON
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CYP15G0401DXB-BGC - Infineon Technologies

Manifakti Nimewo Pati
CYP15G0401DXB-BGC
Manifakti
Infineon Technologies
Allelco Nimewo Pati
32D-CYP15G0401DXB-BGC
ECAD modèl
Pati Deskripsyon
IC TELECOM INTERFACE 256BGA
Pake
256-BGA Exposed Pad
Done fèy
CY(P,V,W)15G0401DXB.pdf
Sètifikasyon nou an
Nan stok: 11720

Jaden obligatwa yo endike pa yon asterisk (*)
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Kantite
EKSPRIME OPSYON
Metòd Peman
Sètifikasyon nou an

Espesifikasyon

Espesifikasyon CYP15G0401DXB-BGC Tech
Infineon Technologies - CYP15G0401DXB-BGC espesifikasyon teknik, atribi, paramèt ak pati ki gen espesifikasyon menm jan ak Infineon Technologies - CYP15G0401DXB-BGC

Pwodwi atribi Valè atribi  
Manifakti Infineon Technologies  
Voltage - Pwovizyon pou 3.135V ~ 3.465V  
Founisè Aparèy pake 256-L2BGA (27x27)  
Seri HOTlink II™  
Pake / Ka 256-BGA Exposed Pad  
Pakèt Tray  
Operating Tanperati 0°C ~ 70°C  
Pwodwi atribi Valè atribi  
Nimewo nan sikui 4  
Mounting Kalite Surface Mount  
Entèfas LVTTL  
Fonksyon Transceiver  
Kouran - Pwovizyon pou 830mA  
Nimewo pwodwi baz CYP15G0401  

Anviwònman & ekspòtasyon klasifikasyon

ATRIBI DESKRIPSYON
RoHs Status RoHS ki pa konfòme
Nivo sansiblite imidite (MSL) 3 (168 Hours)
Rive nan estati REACH Unaffected
ECCN 5A991B1
HTSUS 8542.39.0001

Pati ki gen espesifikasyon menm jan an

Twa pati ki sou bò dwat la gen menm espesifikasyon pou Infineon Technologies CYP15G0401DXB-BGC.

Pwodwi atribi CYP15G0401DXB-BGC CYP15G0402DXB-BGXC CYP15G0402DXB-BGC CYP15G0401DXB-BGI
Nimewo Pati CYP15G0401DXB-BGC CYP15G0402DXB-BGXC CYP15G0402DXB-BGC CYP15G0401DXB-BGI
Manifakti Infineon Technologies Infineon Technologies Infineon Technologies Infineon Technologies
Mounting Kalite Surface Mount Surface Mount Surface Mount Surface Mount
Voltage - Pwovizyon pou 3.135V ~ 3.465V 3.135V ~ 3.465V 3.135V ~ 3.465V 3.135V ~ 3.465V
Pakèt Tray Tray Tray Tray
Pake / Ka 256-BGA Exposed Pad 256-BGA Exposed Pad 256-BGA Exposed Pad 256-BGA Exposed Pad
Founisè Aparèy pake 256-L2BGA (27x27) 256-L2BGA (27x27) 256-L2BGA (27x27) 256-L2BGA (27x27)
Kouran - Pwovizyon pou 830mA 830mA 830mA 830mA
Entèfas LVTTL LVTTL LVTTL LVTTL
Nimewo nan sikui 4 4 4 4
Seri HOTlink II™ HOTlink II™ HOTlink II™ HOTlink II™
Operating Tanperati 0°C ~ 70°C 0°C ~ 70°C 0°C ~ 70°C -40°C ~ 85°C
Fonksyon Transceiver - - Transceiver
Nimewo pwodwi baz CYP15G0401 CYP15G0402 CYP15G0402 CYP15G0401

CYP15G0401DXB-BGC fich PDF

Download CYP15G0401DXB-BGC PDF fich ak dokiman Infineon Technologies pou CYP15G0401DXB-BGC - Infineon Technologies.

PCN anbalaj
Date Code/Shelf Life Chgs 18/Jul/2019.pdf Ship Label REV.pdf
Fich
CY(P,V,W)15G0401DXB.pdf

Shipment

Tan livrezon

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Metòd livrezon

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Mwayennorian Pèp Izrayèl la 6
DHL & FedEx Shipment Chaj Referans
Chajman chaj (kg) Referans DHL (USD $)
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1.00kg-2.00kg USD $ 40.00 - USD $ 80.00
2.00kg-3.00kg USD $ 50.00 - USD $ 100.00
Remak:
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CYP15G0401DXB-BGC Image

CYP15G0401DXB-BGC

Infineon Technologies
32D-CYP15G0401DXB-BGC

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