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KayPwodwi yoSikit entegre Integrated (ICs)Embedded - DSP (Digital Signal Processors)DSP56303AG100
DSP56303AG100 Image
Imaj ka reprezantasyon.
wè espesifikasyon pou detay pwodwi.
EKSPRIME OPSYON
Metòd Peman

DSP56303AG100 - NXP USA Inc.

Manifakti Nimewo Pati
DSP56303AG100
Manifakti
NXP Semiconductors
Allelco Nimewo Pati
32D-DSP56303AG100
ECAD modèl
Pati Deskripsyon
IC DSP 24BIT 100MHZ 144-LQFP
Pake
144-LQFP
Done fèy
DSP56303.pdf
RoHs Status
Sètifikasyon nou an
Nan stok: 6140

Jaden obligatwa yo endike pa yon asterisk (*)
Tanpri voye RFQ, nou pral reponn imedyatman.

Kantite
EKSPRIME OPSYON
Metòd Peman
Sètifikasyon nou an

Espesifikasyon

Espesifikasyon DSP56303AG100 Tech
NXP USA Inc. - DSP56303AG100 espesifikasyon teknik, atribi, paramèt ak pati ki gen espesifikasyon menm jan ak NXP USA Inc. - DSP56303AG100

Pwodwi atribi Valè atribi  
Manifakti NXP Semiconductors  
Voltage - I / O 3.30V  
Voltage - Nwayo 3.30V  
Kalite Fixed Point  
Founisè Aparèy pake 144-LQFP (20x20)  
Seri DSP563xx  
Pake / Ka 144-LQFP  
Pakèt Tray  
Pwodwi atribi Valè atribi  
Operating Tanperati -40°C ~ 100°C (TJ)  
Sou-Chip RAM 24kB  
Ki pa Peye-Volatile memwa ROM (576B)  
Mounting Kalite Surface Mount  
Entèfas Host Interface, SSI, SCI  
Clock revèy 100MHz  
Nimewo pwodwi baz DSP563  

Anviwònman & ekspòtasyon klasifikasyon

ATRIBI DESKRIPSYON
RoHs Status
Nivo sansiblite imidite (MSL) 3 (168 Hours)
Rive nan estati REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001

Pati ki gen espesifikasyon menm jan an

Twa pati ki sou bò dwat la gen menm espesifikasyon pou NXP USA Inc. DSP56303AG100.

Pwodwi atribi DSP56303AG100 DSP56303VL100 DSP56301VF80B1 DSP56301PW80
Nimewo Pati DSP56303AG100 DSP56303VL100 DSP56301VF80B1 DSP56301PW80
Manifakti NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc.
Mounting Kalite Surface Mount Surface Mount Surface Mount Surface Mount
Pakèt Tray Tray Tray Tray
Operating Tanperati -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ)
Clock revèy 100MHz 100MHz 80MHz 80MHz
Pake / Ka 144-LQFP 196-LBGA 252-BGA 208-LQFP
Entèfas Host Interface, SSI, SCI Host Interface, SSI, SCI Host Interface, SSI, SCI Host Interface, SSI, SCI
Founisè Aparèy pake 144-LQFP (20x20) 196-LBGA (15x15) 252-MAPBGA (21x21) 208-TQFP (28x28)
Seri DSP563xx DSP563xx DSP563xx DSP563xx
Kalite Fixed Point Fixed Point Fixed Point Fixed Point
Voltage - I / O 3.30V 3.30V 3.30V 3.30V
Sou-Chip RAM 24kB 24kB 24kB 24kB
Nimewo pwodwi baz DSP563 DSP563 DSP563 DSP563
Ki pa Peye-Volatile memwa ROM (576B) ROM (576B) ROM (9kB) ROM (9kB)
Voltage - Nwayo 3.30V 3.30V 3.30V 3.30V

DSP56303AG100 fich PDF

Download DSP56303AG100 PDF fich ak dokiman NXP USA Inc. pou DSP56303AG100 - NXP USA Inc..

PCN anbalaj
All Dev Label Update 15/Dec/2020.pdf Mult Dev Pkg Seal 15/Dec/2020.pdf
Enfòmasyon sou anviwònman an
NXP USA Inc REACH.pdf NXP USA Inc RoHS Cert.pdf
PCN konsepsyon/spesifikasyon
Mult Dev 25/May/2020.pdf
PCN obsolescence/ eol
Mult Dev 25/Sep/2019.pdf
Fich
DSP56303.pdf

Shipment

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  1. Telefòn
    +00852 9146 4856

Sètifikasyon & Manm

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DSP56303AG100 Image

DSP56303AG100

NXP USA Inc.
32D-DSP56303AG100

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