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KayPwodwi yoSikit entegre Integrated (ICs)Embedded - mikrokontwolèLPC1114FHN33/302K
LPC1114FHN33/302K Image
Imaj ka reprezantasyon.
wè espesifikasyon pou detay pwodwi.

LPC1114FHN33/302K - NXP USA Inc.

Manifakti Nimewo Pati
LPC1114FHN33/302K
Manifakti
NXP Semiconductors
Allelco Nimewo Pati
32D-LPC1114FHN33/302K
ECAD modèl
Pati Deskripsyon
IC MCU 32BIT 32KB FLASH 32HVQFN
Deskripsyon detaye
Pake
32-VQFN Exposed Pad
Done fèy
LPC1110-15.pdf
RoHs Status
Nan stok: 20445

Jaden obligatwa yo endike pa yon asterisk (*)
Tanpri voye RFQ, nou pral reponn imedyatman.

Kantite

Espesifikasyon

Espesifikasyon LPC1114FHN33/302K Tech
NXP USA Inc. - LPC1114FHN33/302K espesifikasyon teknik, atribi, paramèt ak pati ki gen espesifikasyon menm jan ak NXP USA Inc. - LPC1114FHN33/302K

Pwodwi atribi Valè atribi  
Manifakti NXP Semiconductors  
Voltage - Pwovizyon pou (Vcc / Vdd) 1.8V ~ 3.6V  
Founisè Aparèy pake 32-HVQFN (7x7)  
Vitès 50MHz  
Seri LPC1100L  
RAM gwosè 4K x 8  
Kalite Memory Type FLASH  
Pwogram memwa gwosè 32KB (32K x 8)  
Periferik Brown-out Detect/Reset, POR, WDT  
Pake / Ka 32-VQFN Exposed Pad  
Pakèt Tray  
Pwodwi atribi Valè atribi  
Kalite Oscillator Internal  
Operating Tanperati -40°C ~ 85°C (TA)  
Kantite I / O 28  
Mounting Kalite Surface Mount  
EEPROM Size -  
Done konnvètè yo A/D 8x10b SAR  
Nwayo gwosè 32-Bit Single-Core  
Nwayo Processor ARM® Cortex®-M0  
Koneksyon I²C, SPI, UART/USART  
Nimewo pwodwi baz LPC1114  

Pati ki gen espesifikasyon menm jan an

Twa pati ki sou bò dwat la gen menm espesifikasyon pou NXP USA Inc. LPC1114FHN33/302K.

Pwodwi atribi LPC1114FHN33/302K LPC1115FBD48/303 LPC1114LVFHI33/303 LPC1114FHN33/302:5
Nimewo Pati LPC1114FHN33/302K LPC1115FBD48/303 LPC1114LVFHI33/303 LPC1114FHN33/302:5
Manifakti NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc.
Mounting Kalite Surface Mount Surface Mount Surface Mount Surface Mount
Nwayo Processor ARM® Cortex®-M0 ARM® Cortex®-M0 ARM® Cortex®-M0 ARM® Cortex®-M0
Kalite Memory Type FLASH FLASH FLASH FLASH
Kantite I / O 28 42 27 28
Voltage - Pwovizyon pou (Vcc / Vdd) 1.8V ~ 3.6V 1.8V ~ 3.6V 1.65V ~ 1.95V 1.8V ~ 3.6V
RAM gwosè 4K x 8 8K x 8 8K x 8 8K x 8
Kalite Oscillator Internal Internal Internal Internal
Founisè Aparèy pake 32-HVQFN (7x7) 48-LQFP (7x7) 32-HVQFN (5x5) 32-HVQFN (7x7)
Koneksyon I²C, SPI, UART/USART I²C, SPI, UART/USART I²C, SPI, UART/USART I²C, SPI, UART/USART
Periferik Brown-out Detect/Reset, POR, WDT Brown-out Detect/Reset, POR, WDT Brown-out Detect/Reset, POR, WDT Brown-out Detect/Reset, POR, WDT
Operating Tanperati -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Vitès 50MHz 50MHz 50MHz 50MHz
EEPROM Size - - - -
Pake / Ka 32-VQFN Exposed Pad 48-LQFP 32-VFQFN Exposed Pad 32-VQFN Exposed Pad
Seri LPC1100L LPC1100XL LPC1100LV LPC1100L
Pwogram memwa gwosè 32KB (32K x 8) 64KB (64K x 8) 32KB (32K x 8) 32KB (32K x 8)
Done konnvètè yo A/D 8x10b SAR A/D 8x10b A/D 8x8b A/D 8x10b
Pakèt Tray Bulk Tray Tray
Nwayo gwosè 32-Bit Single-Core 32-Bit Single-Core 32-Bit Single-Core 32-Bit Single-Core
Nimewo pwodwi baz LPC1114 LPC1115 LPC1114 LPC1114

LPC1114FHN33/302K fich PDF

Download LPC1114FHN33/302K PDF fich ak dokiman NXP USA Inc. pou LPC1114FHN33/302K - NXP USA Inc..

Enfòmasyon sou anviwònman an
NXP USA Inc REACH.pdf NXP USA Inc RoHS Cert.pdf
PCN anbalaj
5+1 Dry Pack Chg 4/May/2022.pdf Mult Dev Pkg Seal 15/Dec/2020.pdf
Fich
LPC1110-15.pdf

Shipment

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Sètifikasyon & Manm

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LPC1114FHN33/302K Image

LPC1114FHN33/302K

NXP USA Inc.
32D-LPC1114FHN33/302K

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