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KayPwodwi yoSikit entegre Integrated (ICs)Embedded - mikrokontwolèMC9S12XDP512VAG
MC9S12XDP512VAG Image
Imaj ka reprezantasyon.
wè espesifikasyon pou detay pwodwi.

MC9S12XDP512VAG - NXP USA Inc.

Manifakti Nimewo Pati
MC9S12XDP512VAG
Manifakti
NXP Semiconductors
Allelco Nimewo Pati
32D-MC9S12XDP512VAG
ECAD modèl
Pati Deskripsyon
IC MCU 16BIT 512KB FLASH 144LQFP
Deskripsyon detaye
Pake
144-LQFP
Done fèy
MC9S12XDP512 Datasheet.pdf
RoHs Status
Nan stok: 1474

Jaden obligatwa yo endike pa yon asterisk (*)
Tanpri voye RFQ, nou pral reponn imedyatman.

Kantite

Espesifikasyon

Espesifikasyon MC9S12XDP512VAG Tech
NXP USA Inc. - MC9S12XDP512VAG espesifikasyon teknik, atribi, paramèt ak pati ki gen espesifikasyon menm jan ak NXP USA Inc. - MC9S12XDP512VAG

Pwodwi atribi Valè atribi  
Manifakti NXP Semiconductors  
Voltage - Pwovizyon pou (Vcc / Vdd) 2.35V ~ 5.5V  
Founisè Aparèy pake 144-LQFP (20x20)  
Vitès 80MHz  
Seri HCS12X  
RAM gwosè 32K x 8  
Kalite Memory Type FLASH  
Pwogram memwa gwosè 512KB (512K x 8)  
Periferik LVD, POR, PWM, WDT  
Pake / Ka 144-LQFP  
Pakèt Tray  
Pwodwi atribi Valè atribi  
Kalite Oscillator External  
Operating Tanperati -40°C ~ 105°C (TA)  
Kantite I / O 119  
Mounting Kalite Surface Mount  
EEPROM Size 4K x 8  
Done konnvètè yo A/D 24x10b  
Nwayo gwosè 16-Bit  
Nwayo Processor HCS12X  
Koneksyon CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI  
Nimewo pwodwi baz MC9S12  

Pati ki gen espesifikasyon menm jan an

Twa pati ki sou bò dwat la gen menm espesifikasyon pou NXP USA Inc. MC9S12XDP512VAG.

Pwodwi atribi MC9S12XDP512VAG MC9S12XDP512MAL MC9S12XDP512CAL MC9S12XDP512VAG
Nimewo Pati MC9S12XDP512VAG MC9S12XDP512MAL MC9S12XDP512CAL MC9S12XDP512VAG
Manifakti NXP USA Inc. NXP USA Inc. NXP USA Inc. Freescale Semiconductor
EEPROM Size 4K x 8 4K x 8 4K x 8 4K x 8
Periferik LVD, POR, PWM, WDT LVD, POR, PWM, WDT LVD, POR, PWM, WDT LVD, POR, PWM, WDT
Founisè Aparèy pake 144-LQFP (20x20) 112-LQFP (20x20) 112-LQFP (20x20) 144-LQFP (20x20)
Seri HCS12X HCS12X HCS12X HCS12X
Kantite I / O 119 91 91 119
Pwogram memwa gwosè 512KB (512K x 8) 512KB (512K x 8) 512KB (512K x 8) 512KB (512K x 8)
Vitès 80MHz 80MHz 80MHz 80MHz
Done konnvètè yo A/D 24x10b A/D 16x10b A/D 16x10b A/D 24x10b
Voltage - Pwovizyon pou (Vcc / Vdd) 2.35V ~ 5.5V 2.35V ~ 5.5V 2.35V ~ 5.5V 2.35V ~ 5.5V
Nwayo gwosè 16-Bit 16-Bit 16-Bit 16-Bit
RAM gwosè 32K x 8 32K x 8 32K x 8 32K x 8
Kalite Oscillator External External External External
Pakèt Tray Tray Tray Bulk
Koneksyon CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI
Pake / Ka 144-LQFP 112-LQFP 112-LQFP 144-LQFP
Kalite Memory Type FLASH FLASH FLASH FLASH
Operating Tanperati -40°C ~ 105°C (TA) -40°C ~ 125°C (TA) -40°C ~ 85°C (TA) -40°C ~ 105°C (TA)
Nimewo pwodwi baz MC9S12 MC9S12 MC9S12 MC9S12
Nwayo Processor HCS12X HCS12X HCS12X HCS12X
Mounting Kalite Surface Mount Surface Mount Surface Mount Surface Mount

MC9S12XDP512VAG fich PDF

Download MC9S12XDP512VAG PDF fich ak dokiman NXP USA Inc. pou MC9S12XDP512VAG - NXP USA Inc..

PCN anbalaj
All Dev Label Update 15/Dec/2020.pdf Mult Dev Pkg Seal 15/Dec/2020.pdf
Enfòmasyon sou anviwònman an
NXP USA Inc REACH.pdf NXP USA Inc RoHS Cert.pdf
PCN konsepsyon/spesifikasyon
Mult Dev 25/May/2020.pdf Trace Marking Removal 20/Jun/2019.pdf
Fich
MC9S12XDP512 Datasheet.pdf

Shipment

Tan livrezon

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Pri livrezon

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Metòd livrezon

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  1. Telefòn
    +00852 9146 4856

Sètifikasyon & Manm

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MC9S12XDP512VAG Image

MC9S12XDP512VAG

NXP USA Inc.
32D-MC9S12XDP512VAG

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