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KayPwodwi yoSikit entegre Integrated (ICs)Embedded - mikrokontwolèS9S08DZ60F2CLH
S9S08DZ60F2CLH Image
Imaj ka reprezantasyon.
wè espesifikasyon pou detay pwodwi.
EKSPRIME OPSYON
Metòd Peman

S9S08DZ60F2CLH - NXP USA Inc.

Manifakti Nimewo Pati
S9S08DZ60F2CLH
Manifakti
NXP Semiconductors
Allelco Nimewo Pati
32D-S9S08DZ60F2CLH
ECAD modèl
Pati Deskripsyon
IC MCU 8BIT 60KB FLASH 64LQFP
Pake
64-LQFP
Done fèy
MC9S08DZ60,48,32,16.pdf
RoHs Status
Sètifikasyon nou an
Nan stok: 5241

Jaden obligatwa yo endike pa yon asterisk (*)
Tanpri voye RFQ, nou pral reponn imedyatman.

Kantite
EKSPRIME OPSYON
Metòd Peman
Sètifikasyon nou an

Espesifikasyon

Espesifikasyon S9S08DZ60F2CLH Tech
NXP USA Inc. - S9S08DZ60F2CLH espesifikasyon teknik, atribi, paramèt ak pati ki gen espesifikasyon menm jan ak NXP USA Inc. - S9S08DZ60F2CLH

Pwodwi atribi Valè atribi  
Manifakti NXP Semiconductors  
Voltage - Pwovizyon pou (Vcc / Vdd) 2.7V ~ 5.5V  
Founisè Aparèy pake 64-LQFP (10x10)  
Vitès 40MHz  
Seri S08  
RAM gwosè 4K x 8  
Kalite Memory Type FLASH  
Pwogram memwa gwosè 60KB (60K x 8)  
Periferik LVD, POR, PWM, WDT  
Pake / Ka 64-LQFP  
Pakèt Tray  
Pwodwi atribi Valè atribi  
Kalite Oscillator External  
Operating Tanperati -40°C ~ 85°C (TA)  
Kantite I / O 53  
Mounting Kalite Surface Mount  
EEPROM Size 2K x 8  
Done konnvètè yo A/D 24x12b  
Nwayo gwosè 8-Bit  
Nwayo Processor S08  
Koneksyon CANbus, I²C, LINbus, SCI, SPI  
Nimewo pwodwi baz S9S08  

Anviwònman & ekspòtasyon klasifikasyon

ATRIBI DESKRIPSYON
RoHs Status
Nivo sansiblite imidite (MSL) 3 (168 Hours)
Rive nan estati REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001

Pati ki gen espesifikasyon menm jan an

Twa pati ki sou bò dwat la gen menm espesifikasyon pou NXP USA Inc. S9S08DZ60F2CLH.

Pwodwi atribi S9S08DZ60F2CLH S9S08DZ60F1VLH S9S08DZ60F2MLF S9S08DZ60F2MLF
Nimewo Pati S9S08DZ60F2CLH S9S08DZ60F1VLH S9S08DZ60F2MLF S9S08DZ60F2MLF
Manifakti NXP USA Inc. NXP USA Inc. NXP USA Inc. Freescale Semiconductor
Pakèt Tray Tray Tray Bulk
Operating Tanperati -40°C ~ 85°C (TA) -40°C ~ 105°C (TA) -40°C ~ 125°C (TA) -40°C ~ 125°C (TA)
RAM gwosè 4K x 8 4K x 8 4K x 8 4K x 8
Koneksyon CANbus, I²C, LINbus, SCI, SPI CANbus, I²C, LINbus, SCI, SPI CANbus, I²C, LINbus, SCI, SPI CANbus, I²C, LINbus, SCI, SPI
Founisè Aparèy pake 64-LQFP (10x10) 64-LQFP (10x10) 48-LQFP (7x7) 48-LQFP (7x7)
EEPROM Size 2K x 8 2K x 8 2K x 8 2K x 8
Pwogram memwa gwosè 60KB (60K x 8) 60KB (60K x 8) 60KB (60K x 8) 60KB (60K x 8)
Done konnvètè yo A/D 24x12b A/D 24x12b A/D 16x12b A/D 16x12b
Vitès 40MHz 40MHz 40MHz 40MHz
Voltage - Pwovizyon pou (Vcc / Vdd) 2.7V ~ 5.5V 2.7V ~ 5.5V 2.7V ~ 5.5V 2.7V ~ 5.5V
Nimewo pwodwi baz S9S08 S9S08 S9S08 S9S08
Kalite Memory Type FLASH FLASH FLASH FLASH
Kalite Oscillator External External External External
Kantite I / O 53 53 39 39
Nwayo Processor S08 S08 S08 S08
Seri S08 S08 S08 S08
Periferik LVD, POR, PWM, WDT LVD, POR, PWM, WDT LVD, POR, PWM, WDT LVD, POR, PWM, WDT
Pake / Ka 64-LQFP 64-LQFP 48-LQFP 48-LQFP
Mounting Kalite Surface Mount Surface Mount Surface Mount Surface Mount
Nwayo gwosè 8-Bit 8-Bit 8-Bit 8-Bit

S9S08DZ60F2CLH fich PDF

Download S9S08DZ60F2CLH PDF fich ak dokiman NXP USA Inc. pou S9S08DZ60F2CLH - NXP USA Inc..

Enfòmasyon sou anviwònman an
NXP USA Inc REACH.pdf NXP USA Inc RoHS Cert.pdf
PCN anbalaj
Mult Dev Pkg Seal 15/Dec/2020.pdf Mult Dev Pkg Chgs 8/Feb/2022.pdf
Asanble PCN/orijin
Mult Dev Test Site 25/Mar/2021.pdf
Fich
MC9S08DZ60,48,32,16.pdf
PCN konsepsyon/spesifikasyon
Gold to Copper Wire 31/Jul/2013.pdf

Shipment

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Metòd livrezon

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    +00852 9146 4856

Sètifikasyon & Manm

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S9S08DZ60F2CLH Image

S9S08DZ60F2CLH

NXP USA Inc.
32D-S9S08DZ60F2CLH

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