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KayPwodwi yoSikit entegre Integrated (ICs)Embedded - mikrokontwolèS9S12DG12F1MPVE
S9S12DG12F1MPVE Image
Imaj ka reprezantasyon.
wè espesifikasyon pou detay pwodwi.

S9S12DG12F1MPVE - NXP USA Inc.

Manifakti Nimewo Pati
S9S12DG12F1MPVE
Manifakti
NXP Semiconductors
Allelco Nimewo Pati
32D-S9S12DG12F1MPVE
ECAD modèl
Pati Deskripsyon
IC MCU 16BIT 128KB FLASH 112LQFP
Deskripsyon detaye
Pake
112-LQFP
Done fèy
Cylindrical Battery Holders.pdf
RoHs Status
Nan stok: 1616

Jaden obligatwa yo endike pa yon asterisk (*)
Tanpri voye RFQ, nou pral reponn imedyatman.

Kantite

Espesifikasyon

Espesifikasyon S9S12DG12F1MPVE Tech
NXP USA Inc. - S9S12DG12F1MPVE espesifikasyon teknik, atribi, paramèt ak pati ki gen espesifikasyon menm jan ak NXP USA Inc. - S9S12DG12F1MPVE

Pwodwi atribi Valè atribi  
Manifakti NXP Semiconductors  
Voltage - Pwovizyon pou (Vcc / Vdd) 2.35V ~ 5.25V  
Founisè Aparèy pake 112-LQFP (20x20)  
Vitès 25MHz  
Seri HCS12  
RAM gwosè 8K x 8  
Kalite Memory Type FLASH  
Pwogram memwa gwosè 128KB (128K x 8)  
Periferik PWM, WDT  
Pake / Ka 112-LQFP  
Pakèt Bulk  
Pwodwi atribi Valè atribi  
Kalite Oscillator Internal  
Operating Tanperati -40°C ~ 125°C (TA)  
Kantite I / O 91  
Mounting Kalite Surface Mount  
EEPROM Size 2K x 8  
Done konnvètè yo A/D 16x10b  
Nwayo gwosè 16-Bit  
Nwayo Processor HCS12  
Koneksyon CANbus, I²C, SCI, SPI  
Nimewo pwodwi baz S9S12  

Pati ki gen espesifikasyon menm jan an

Twa pati ki sou bò dwat la gen menm espesifikasyon pou NXP USA Inc. S9S12DG12F1MPVE.

Pwodwi atribi S9S12DG12F1MPVE S9S12D64F0VPVER S9S12DG12F1VPVE S9S12DG12F1VPVER
Nimewo Pati S9S12DG12F1MPVE S9S12D64F0VPVER S9S12DG12F1VPVE S9S12DG12F1VPVER
Manifakti NXP USA Inc. Analog Devices Inc. Freescale Semiconductor NXP USA Inc.
Kalite Oscillator Internal - Internal Internal
Seri HCS12 - HCS12 HCS12
Nwayo gwosè 16-Bit - 16-Bit 16-Bit
Koneksyon CANbus, I²C, SCI, SPI - CANbus, I²C, SCI, SPI CANbus, I²C, SCI, SPI
EEPROM Size 2K x 8 - 2K x 8 2K x 8
Founisè Aparèy pake 112-LQFP (20x20) - 112-LQFP (20x20) 112-LQFP (20x20)
Nwayo Processor HCS12 - HCS12 HCS12
Mounting Kalite Surface Mount - Surface Mount Surface Mount
Pake / Ka 112-LQFP - 112-LQFP 112-LQFP
RAM gwosè 8K x 8 - 8K x 8 8K x 8
Voltage - Pwovizyon pou (Vcc / Vdd) 2.35V ~ 5.25V - 2.35V ~ 5.25V 2.35V ~ 5.25V
Kalite Memory Type FLASH - FLASH FLASH
Pakèt Bulk Bulk Bulk Tape & Reel (TR)
Periferik PWM, WDT - PWM, WDT PWM, WDT
Done konnvètè yo A/D 16x10b - A/D 16x10b A/D 16x10b
Pwogram memwa gwosè 128KB (128K x 8) - 128KB (128K x 8) 128KB (128K x 8)
Vitès 25MHz - 25MHz 25MHz
Nimewo pwodwi baz S9S12 - S9S12 S9S12
Kantite I / O 91 - 91 91
Operating Tanperati -40°C ~ 125°C (TA) - -40°C ~ 105°C (TA) -40°C ~ 105°C (TA)

S9S12DG12F1MPVE fich PDF

Download S9S12DG12F1MPVE PDF fich ak dokiman NXP USA Inc. pou S9S12DG12F1MPVE - NXP USA Inc..

PCN anbalaj
All Dev Label Update 15/Dec/2020.pdf Mult Dev Pkg Seal 15/Dec/2020.pdf
Enfòmasyon sou anviwònman an
NXP USA Inc REACH.pdf NXP USA Inc RoHS Cert.pdf
PCN konsepsyon/spesifikasyon
Cylindrical Battery Holders.pdf
Fich
Cylindrical Battery Holders.pdf

Shipment

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Sètifikasyon & Manm

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S9S12DG12F1MPVE

NXP USA Inc.
32D-S9S12DG12F1MPVE

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