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KayPwodwi yoSikit entegre Integrated (ICs)Embedded - mikrokontwolèSPC5777CCK3MME3R
SPC5777CCK3MME3R Image
Imaj ka reprezantasyon.
wè espesifikasyon pou detay pwodwi.

SPC5777CCK3MME3R - NXP USA Inc.

Manifakti Nimewo Pati
SPC5777CCK3MME3R
Manifakti
NXP Semiconductors
Allelco Nimewo Pati
32D-SPC5777CCK3MME3R
ECAD modèl
Pati Deskripsyon
IC MCU 32BIT 8MB FLASH 416MAPBGA
Deskripsyon detaye
Pake
416-BGA
Done fèy
MPC5777C.pdf
MPC5777C.pdf
RoHs Status
Nan stok: 860

Jaden obligatwa yo endike pa yon asterisk (*)
Tanpri voye RFQ, nou pral reponn imedyatman.

Kantite

Espesifikasyon

Espesifikasyon SPC5777CCK3MME3R Tech
NXP USA Inc. - SPC5777CCK3MME3R espesifikasyon teknik, atribi, paramèt ak pati ki gen espesifikasyon menm jan ak NXP USA Inc. - SPC5777CCK3MME3R

Pwodwi atribi Valè atribi  
Manifakti NXP Semiconductors  
Voltage - Pwovizyon pou (Vcc / Vdd) 3V ~ 5.5V  
Founisè Aparèy pake 416-MAPBGA (27x27)  
Vitès 264MHz  
Seri MPC57xx  
RAM gwosè 512K x 8  
Kalite Memory Type FLASH  
Pwogram memwa gwosè 8MB (8M x 8)  
Periferik DMA, LVD, POR, Zipwire  
Pake / Ka 416-BGA  
Pwodwi atribi Valè atribi  
Pakèt Tape & Reel (TR)  
Kalite Oscillator Internal  
Operating Tanperati -40°C ~ 125°C (TA)  
Mounting Kalite Surface Mount  
EEPROM Size -  
Done konnvètè yo A/D 16b Sigma-Delta, eQADC  
Nwayo gwosè 32-Bit Tri-Core  
Nwayo Processor e200z7  
Koneksyon CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI  
Nimewo pwodwi baz SPC5777  

Pati ki gen espesifikasyon menm jan an

Twa pati ki sou bò dwat la gen menm espesifikasyon pou NXP USA Inc. SPC5777CCK3MME3R.

Pwodwi atribi SPC5777CCK3MME3R SPC5777CDK3MMO3 SPC574S64E3CEFAR SPC5775KK2MMY3AR
Nimewo Pati SPC5777CCK3MME3R SPC5777CDK3MMO3 SPC574S64E3CEFAR SPC5775KK2MMY3AR
Manifakti NXP USA Inc. NXP USA Inc. STMicroelectronics NXP USA Inc.
Periferik DMA, LVD, POR, Zipwire DMA, LVD, POR, Zipwire DMA, LVD, POR, WDT -
Nimewo pwodwi baz SPC5777 SPC5777 SPC574 SPC5775
Seri MPC57xx MPC57xx - *
Koneksyon CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI CANbus, FlexRay, LINbus, SPI, UART/USART -
Voltage - Pwovizyon pou (Vcc / Vdd) 3V ~ 5.5V 3V ~ 5.5V 3.135V ~ 5.25V -
EEPROM Size - - 64K x 8 -
Done konnvètè yo A/D 16b Sigma-Delta, eQADC A/D 16b Sigma-Delta, eQADC - -
Kalite Oscillator Internal Internal Internal -
Vitès 264MHz 264MHz 140MHz -
Founisè Aparèy pake 416-MAPBGA (27x27) 516-MAPBGA (27x27) 100-eTQFP (14x14) -
Nwayo Processor e200z7 e200z7 e200z4 -
Mounting Kalite Surface Mount Surface Mount Surface Mount -
Operating Tanperati -40°C ~ 125°C (TA) -40°C ~ 125°C (TA) -40°C ~ 125°C (TA) -
Pwogram memwa gwosè 8MB (8M x 8) 8MB (8M x 8) 1.5MB (1.5M x 8) -
RAM gwosè 512K x 8 512K x 8 96K x 8 -
Pakèt Tape & Reel (TR) Tray Tape & Reel (TR) Tape & Reel (TR)
Pake / Ka 416-BGA 516-BGA 100-TQFP Exposed Pad -
Kalite Memory Type FLASH FLASH FLASH -
Nwayo gwosè 32-Bit Tri-Core 32-Bit Tri-Core 32-Bit Dual-Core -

SPC5777CCK3MME3R fich PDF

Download SPC5777CCK3MME3R PDF fich ak dokiman NXP USA Inc. pou SPC5777CCK3MME3R - NXP USA Inc..

PCN anbalaj
All Dev Label Update 15/Dec/2020.pdf Mult Dev Pkg Seal 15/Dec/2020.pdf
Enfòmasyon sou anviwònman an
NXP USA Inc REACH.pdf NXP USA Inc RoHS Cert.pdf
Fich
MPC5777C.pdf
Html fich
MPC5777C.pdf
PCN konsepsyon/spesifikasyon
MPC5777C 08/May/2021.pdf

Shipment

Tan livrezon

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Pri livrezon

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Metòd livrezon

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Japon 4
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2.00kg-3.00kg USD $ 50.00 - USD $ 100.00
Remak:
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  1. Telefòn
    +00852 9146 4856

Sètifikasyon & Manm

Wè plis
SPC5777CCK3MME3R Image

SPC5777CCK3MME3R

NXP USA Inc.
32D-SPC5777CCK3MME3R

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