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KayPwodwi yoSikit entegre Integrated (ICs)PMIC - Voltage Regulators - LineyèBD18GA5WEFJ-E2
BD18GA5WEFJ-E2 Image
Imaj ka reprezantasyon.
wè espesifikasyon pou detay pwodwi.

BD18GA5WEFJ-E2 - Rohm Semiconductor

Manifakti Nimewo Pati
BD18GA5WEFJ-E2
Manifakti
LAPIS Technology
Allelco Nimewo Pati
32D-BD18GA5WEFJ-E2
ECAD modèl
Pati Deskripsyon
IC REG LINEAR 1.8V 500MA 8HTSOP
Deskripsyon detaye
Pake
8-SOIC (0.154", 3.90mm Width) Exposed Pad
Done fèy
HTSOP-J8 Taping Spec.pdf
BDxxGA5WEFJ.pdf
RoHs Status
Nan stok: 144400

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Kantite

Espesifikasyon

Espesifikasyon BD18GA5WEFJ-E2 Tech
Rohm Semiconductor - BD18GA5WEFJ-E2 espesifikasyon teknik, atribi, paramèt ak pati ki gen espesifikasyon menm jan ak Rohm Semiconductor - BD18GA5WEFJ-E2

Pwodwi atribi Valè atribi  
Manifakti LAPIS Technology  
Voltage Dropout (Max) 0.9V @ 500mA  
Voltage - Sòti (Min / Fiks) 1.8V  
Voltage - Sòti (Max) -  
Voltage - Antre (Max) 14V  
Founisè Aparèy pake 8-HTSOP-J  
Seri -  
Pwoteksyon Features Over Current, Over Temperature, Soft Start  
Pake / Ka 8-SOIC (0.154", 3.90mm Width) Exposed Pad  
Pakèt Tape & Reel (TR)  
PSRR -  
Pwodwi atribi Valè atribi  
Kalite Sòti Fixed  
Sòti konte genyen Positive  
Operating Tanperati -25°C ~ 85°C  
Kantite regilatè yo 1  
Mounting Kalite Surface Mount  
Kouran - Pwovizyon pou (Max) 900 µA  
Kouran - Quiescent (Iq) 0.6 mA  
Kouran - Sòti 500mA  
Kontwòl Features Enable  
Nimewo pwodwi baz BD18GA5  

Pati ki gen espesifikasyon menm jan an

Twa pati ki sou bò dwat la gen menm espesifikasyon pou Rohm Semiconductor BD18GA5WEFJ-E2.

Pwodwi atribi BD18GA5WEFJ-E2 BD18IC0WEFJ-E2 BD18IA5MEFJ-ME2 BD18GA3WEFJ-E2
Nimewo Pati BD18GA5WEFJ-E2 BD18IC0WEFJ-E2 BD18IA5MEFJ-ME2 BD18GA3WEFJ-E2
Manifakti Rohm Semiconductor Rohm Semiconductor Rohm Semiconductor Rohm Semiconductor
Kontwòl Features Enable Enable Enable Enable, Soft Start
PSRR - - - -
Operating Tanperati -25°C ~ 85°C -25°C ~ 85°C -40°C ~ 105°C -25°C ~ 85°C
Pwoteksyon Features Over Current, Over Temperature, Soft Start Over Current, Over Temperature, Soft Start Over Current, Over Temperature, Soft Start Over Current, Over Temperature, Soft Start
Pake / Ka 8-SOIC (0.154", 3.90mm Width) Exposed Pad 8-SOIC (0.154', 3.90mm Width) Exposed Pad 8-SOIC (0.154', 3.90mm Width) Exposed Pad 8-SOIC (0.154", 3.90mm Width) Exposed Pad
Kouran - Sòti 500mA 1A 500mA 300mA
Voltage - Sòti (Min / Fiks) 1.8V 1.8V 1.8V 1.8V
Voltage - Antre (Max) 14V 5.5V 5.5V 14V
Voltage - Sòti (Max) - - - -
Kouran - Pwovizyon pou (Max) 900 µA 500 µA 700 µA 900 µA
Seri - - Automotive, AEC-Q100 -
Mounting Kalite Surface Mount Surface Mount Surface Mount Surface Mount
Founisè Aparèy pake 8-HTSOP-J 8-HTSOP-J 8-HTSOP-J 8-HTSOP-J
Sòti konte genyen Positive Positive Positive Positive
Pakèt Tape & Reel (TR) Tape & Reel (TR) Tape & Reel (TR) Tape & Reel (TR)
Kantite regilatè yo 1 1 1 1
Nimewo pwodwi baz BD18GA5 BD18IC0 BD18IA5 BD18GA3
Voltage Dropout (Max) 0.9V @ 500mA 0.6V @ 1A 0.9V @ 500mA 0.9V @ 300mA
Kalite Sòti Fixed Fixed Fixed Fixed
Kouran - Quiescent (Iq) 0.6 mA 0.25 mA 0.25 mA 0.6 mA

BD18GA5WEFJ-E2 fich PDF

Download BD18GA5WEFJ-E2 PDF fich ak dokiman Rohm Semiconductor pou BD18GA5WEFJ-E2 - Rohm Semiconductor.

Html fich
HTSOP-J8 Taping Spec.pdf BDxxGA5WEFJ.pdf
Lòt dokiman ki gen rapò
BD18GA5WEFJ-E2 Flammability.pdf
Enfòmasyon sou anviwònman an
BD18GA5WEFJ-E2 Whisker Info.pdf

Shipment

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Sètifikasyon & Manm

Wè plis
BD18GA5WEFJ-E2 Image

BD18GA5WEFJ-E2

Rohm Semiconductor
32D-BD18GA5WEFJ-E2

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