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KayPwodwi yoSikit entegre Integrated (ICs)PMIC - regilatè vòltaj - DC DC Regilatè oblijeBD89630EFJ-E2
BD89630EFJ-E2 Image
Imaj ka reprezantasyon.
wè espesifikasyon pou detay pwodwi.

BD89630EFJ-E2 - Rohm Semiconductor

Manifakti Nimewo Pati
BD89630EFJ-E2
Manifakti
LAPIS Technology
Allelco Nimewo Pati
32D-BD89630EFJ-E2
ECAD modèl
Pati Deskripsyon
IC REG BUCK ADJ 2A 8HTSOP-J
Deskripsyon detaye
Pake
8-SOIC (0.154", 3.90mm Width) Exposed Pad
Done fèy
HTSOP-J8 Taping Spec.pdf
BD89630EFJ.pdf
RoHs Status
Nan stok: 63850

Jaden obligatwa yo endike pa yon asterisk (*)
Tanpri voye RFQ, nou pral reponn imedyatman.

Kantite

Espesifikasyon

Espesifikasyon BD89630EFJ-E2 Tech
Rohm Semiconductor - BD89630EFJ-E2 espesifikasyon teknik, atribi, paramèt ak pati ki gen espesifikasyon menm jan ak Rohm Semiconductor - BD89630EFJ-E2

Pwodwi atribi Valè atribi  
Manifakti LAPIS Technology  
Voltage - Sòti (Min / Fiks) 1V  
Voltage - Sòti (Max) 2.5V  
Voltage - Antre (Min) 2.7V  
Voltage - Antre (Max) 5.5V  
Topoloji Buck  
Synchronous redresman Yes  
Founisè Aparèy pake 8-HTSOP-J  
Seri -  
Pake / Ka 8-SOIC (0.154", 3.90mm Width) Exposed Pad  
Pwodwi atribi Valè atribi  
Pakèt Tape & Reel (TR)  
Kalite Sòti Adjustable  
Sòti konte genyen Positive  
Operating Tanperati -20°C ~ 85°C (TA)  
Nimewo nan Outputs 1  
Mounting Kalite Surface Mount  
Fonksyon Step-Down  
Frekans - oblije chanje 1MHz  
Kouran - Sòti 2A  
Nimewo pwodwi baz BD89630  

Pati ki gen espesifikasyon menm jan an

Twa pati ki sou bò dwat la gen menm espesifikasyon pou Rohm Semiconductor BD89630EFJ-E2.

Pwodwi atribi BD89630EFJ-E2 BD8924G-GTR BD8967FVM-TR BD8962MUV-E2
Nimewo Pati BD89630EFJ-E2 BD8924G-GTR BD8967FVM-TR BD8962MUV-E2
Manifakti Rohm Semiconductor Rohm Semiconductor Rohm Semiconductor Rohm Semiconductor
Voltage - Antre (Max) 5.5V 5.5V 5.5V 5.5V
Kalite Sòti Adjustable Fixed Fixed Adjustable
Sòti konte genyen Positive Positive Positive Positive
Pake / Ka 8-SOIC (0.154", 3.90mm Width) Exposed Pad SC-74A, SOT-753 8-VSSOP, 8-MSOP (0.110', 2.80mm Width) 20-VFQFN Exposed Pad
Operating Tanperati -20°C ~ 85°C (TA) -30°C ~ 85°C (TA) -25°C ~ 85°C (TA) -40°C ~ 105°C (TA)
Topoloji Buck Boost Buck Buck
Nimewo nan Outputs 1 1 1 1
Seri - - - -
Voltage - Sòti (Max) 2.5V - - 2.5V
Synchronous redresman Yes No Yes Yes
Kouran - Sòti 2A 4mA 800mA 3A
Voltage - Sòti (Min / Fiks) 1V 31V 3.3V 0.8V
Founisè Aparèy pake 8-HTSOP-J 5-SSOP 8-MSOP VQFN020V4040
Mounting Kalite Surface Mount Surface Mount Surface Mount Surface Mount
Fonksyon Step-Down Step-Up Step-Down Step-Down
Frekans - oblije chanje 1MHz 400kHz 1MHz 1MHz
Voltage - Antre (Min) 2.7V 4.5V 4.5V 2.7V
Nimewo pwodwi baz BD89630 BD8924 BD8967 BD8962
Pakèt Tape & Reel (TR) Tape & Reel (TR) Cut Tape (CT) Tape & Reel (TR)

BD89630EFJ-E2 fich PDF

Download BD89630EFJ-E2 PDF fich ak dokiman Rohm Semiconductor pou BD89630EFJ-E2 - Rohm Semiconductor.

Html fich
HTSOP-J8 Taping Spec.pdf
Fich
BD89630EFJ.pdf
Lòt dokiman ki gen rapò
BD89630EFJ-E2 Flammability.pdf
Enfòmasyon sou anviwònman an
BD89630EFJ-E2 Whisker Info.pdf

Shipment

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    +00852 9146 4856

Sètifikasyon & Manm

Wè plis
BD89630EFJ-E2 Image

BD89630EFJ-E2

Rohm Semiconductor
32D-BD89630EFJ-E2

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