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KayPwodwi yoSikit entegre Integrated (ICs)Embedded - Sistèm sou Chip (SoC)XC7Z035-1FBG676I
XC7Z035-1FBG676I Image
Imaj ka reprezantasyon.
wè espesifikasyon pou detay pwodwi.
EKSPRIME OPSYON
Metòd Peman

XC7Z035-1FBG676I - AMD

Manifakti Nimewo Pati
XC7Z035-1FBG676I
Manifakti
AMD Xilinx
Allelco Nimewo Pati
32D-XC7Z035-1FBG676I
ECAD modèl
Pati Deskripsyon
IC SOC CORTEX-A9 667MHZ 676FCBGA
Pake
676-BBGA, FCBGA
Done fèy
XC7Z035-1FBG676I.pdf
RoHs Status
Sètifikasyon nou an
Nan stok: 22

Jaden obligatwa yo endike pa yon asterisk (*)
Tanpri voye RFQ, nou pral reponn imedyatman.

Kantite
EKSPRIME OPSYON
Metòd Peman
Sètifikasyon nou an

Espesifikasyon

Espesifikasyon XC7Z035-1FBG676I Tech
AMD - XC7Z035-1FBG676I espesifikasyon teknik, atribi, paramèt ak pati ki gen espesifikasyon menm jan ak AMD - XC7Z035-1FBG676I

Pwodwi atribi Valè atribi  
Manifakti AMD Xilinx  
Founisè Aparèy pake 676-FCBGA (27x27)  
Vitès 667MHz  
Seri Zynq®-7000  
RAM gwosè 256KB  
Prensipal atribi Kintex™-7 FPGA, 275K Logic Cells  
Periferik DMA  
Pake / Ka 676-BBGA, FCBGA  
Pwodwi atribi Valè atribi  
Pakèt Tray  
Operating Tanperati -40°C ~ 100°C (TJ)  
Kantite I / O 130  
Flash Size -  
Nwayo Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™  
Koneksyon CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG  
Nimewo pwodwi baz XC7Z035  
Achitekti MCU, FPGA  

Anviwònman & ekspòtasyon klasifikasyon

ATRIBI DESKRIPSYON
RoHs Status
Nivo sansiblite imidite (MSL) 3 (168 Hours)
Rive nan estati REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001

Pati ki gen espesifikasyon menm jan an

Twa pati ki sou bò dwat la gen menm espesifikasyon pou AMD XC7Z035-1FBG676I.

Pwodwi atribi XC7Z035-1FBG676I XC7Z030-3FFG676E XC7Z035-2FFG676E XC7Z030-L2SBG485I
Nimewo Pati XC7Z035-1FBG676I XC7Z030-3FFG676E XC7Z035-2FFG676E XC7Z030-L2SBG485I
Manifakti AMD AMD AMD AMD
Prensipal atribi Kintex™-7 FPGA, 275K Logic Cells Kintex™-7 FPGA, 125K Logic Cells Kintex™-7 FPGA, 275K Logic Cells Kintex™-7 FPGA, 125K Logic Cells
Nwayo Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Vitès 667MHz 1GHz 800MHz 800MHz
Pakèt Tray Tray Tray Tray
Periferik DMA DMA DMA DMA
Nimewo pwodwi baz XC7Z035 XC7Z030 XC7Z035 XC7Z030
Koneksyon CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Tanperati -40°C ~ 100°C (TJ) 0°C ~ 100°C (TJ) 0°C ~ 100°C (TJ) -40°C ~ 100°C (TJ)
Flash Size - - - -
Pake / Ka 676-BBGA, FCBGA 676-BBGA, FCBGA 676-BBGA, FCBGA 484-FBGA, FCBGA
RAM gwosè 256KB 256KB 256KB 256KB
Achitekti MCU, FPGA MCU, FPGA MCU, FPGA MCU, FPGA
Kantite I / O 130 130 130 130
Founisè Aparèy pake 676-FCBGA (27x27) 676-FCBGA (27x27) 676-FCBGA (27x27) 484-FCBGA (19x19)
Seri Zynq®-7000 Zynq®-7000 Zynq®-7000 Zynq®-7000

XC7Z035-1FBG676I fich PDF

Download XC7Z035-1FBG676I PDF fich ak dokiman AMD pou XC7Z035-1FBG676I - AMD.

Enfòmasyon sou anviwònman an
Xilinx REACH211 Cert.pdf
PCN anbalaj
2.73KHz.pdf
PCN konsepsyon/spesifikasyon
Product Marking Chg 31/Oct/2016.pdf

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32D-XC7Z035-1FBG676I

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