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KayPwodwi yoSikit entegre Integrated (ICs)Embedded - Sistèm sou Chip (SoC)XC7Z035-1FFG676C
XC7Z035-1FFG676C Image
Imaj ka reprezantasyon.
wè espesifikasyon pou detay pwodwi.

XC7Z035-1FFG676C - AMD

Manifakti Nimewo Pati
XC7Z035-1FFG676C
Manifakti
AMD Xilinx
Allelco Nimewo Pati
32D-XC7Z035-1FFG676C
ECAD modèl
Pati Deskripsyon
IC SOC CORTEX-A9 667MHZ 676FCBGA
Deskripsyon detaye
Pake
676-BBGA, FCBGA
Done fèy
XC7Z035-1FFG676C.pdf
RoHs Status
Nan stok: 30

Jaden obligatwa yo endike pa yon asterisk (*)
Tanpri voye RFQ, nou pral reponn imedyatman.

Kantite

Espesifikasyon

Espesifikasyon XC7Z035-1FFG676C Tech
AMD - XC7Z035-1FFG676C espesifikasyon teknik, atribi, paramèt ak pati ki gen espesifikasyon menm jan ak AMD - XC7Z035-1FFG676C

Pwodwi atribi Valè atribi  
Manifakti AMD Xilinx  
Founisè Aparèy pake 676-FCBGA (27x27)  
Vitès 667MHz  
Seri Zynq®-7000  
RAM gwosè 256KB  
Prensipal atribi Kintex™-7 FPGA, 275K Logic Cells  
Periferik DMA  
Pake / Ka 676-BBGA, FCBGA  
Pwodwi atribi Valè atribi  
Pakèt Tray  
Operating Tanperati 0°C ~ 85°C (TJ)  
Kantite I / O 130  
Flash Size -  
Nwayo Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™  
Koneksyon CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG  
Nimewo pwodwi baz XC7Z035  
Achitekti MCU, FPGA  

Pati ki gen espesifikasyon menm jan an

Twa pati ki sou bò dwat la gen menm espesifikasyon pou AMD XC7Z035-1FFG676C.

Pwodwi atribi XC7Z035-1FFG676C XC7Z035-1FFG900I XC7Z035-1FBG676I XC7Z030-L2FBG676I
Nimewo Pati XC7Z035-1FFG676C XC7Z035-1FFG900I XC7Z035-1FBG676I XC7Z030-L2FBG676I
Manifakti AMD AMD AMD AMD
Pake / Ka 676-BBGA, FCBGA 900-BBGA, FCBGA 676-BBGA, FCBGA 676-BBGA, FCBGA
Periferik DMA DMA DMA DMA
Founisè Aparèy pake 676-FCBGA (27x27) 900-FCBGA (31x31) 676-FCBGA (27x27) 676-FCBGA (27x27)
RAM gwosè 256KB 256KB 256KB 256KB
Pakèt Tray Tray Tray Tray
Vitès 667MHz 667MHz 667MHz 800MHz
Koneksyon CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Kantite I / O 130 130 130 130
Nwayo Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Seri Zynq®-7000 Zynq®-7000 Zynq®-7000 Zynq®-7000
Nimewo pwodwi baz XC7Z035 XC7Z035 XC7Z035 XC7Z030
Achitekti MCU, FPGA MCU, FPGA MCU, FPGA MCU, FPGA
Flash Size - - - -
Operating Tanperati 0°C ~ 85°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ)
Prensipal atribi Kintex™-7 FPGA, 275K Logic Cells Kintex™-7 FPGA, 275K Logic Cells Kintex™-7 FPGA, 275K Logic Cells Kintex™-7 FPGA, 125K Logic Cells

XC7Z035-1FFG676C fich PDF

Download XC7Z035-1FFG676C PDF fich ak dokiman AMD pou XC7Z035-1FFG676C - AMD.

Enfòmasyon sou anviwònman an
Xilinx REACH211 Cert.pdf
PCN konsepsyon/spesifikasyon
Cross-Ship Lead-Free Notice 31/Oct/2016.pdf
PCN anbalaj
Mult Devices 26/Jun/2017.pdf

Shipment

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XC7Z035-1FFG676C Image

XC7Z035-1FFG676C

AMD
32D-XC7Z035-1FFG676C

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