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KayPwodwi yoSikit entegre Integrated (ICs)Embedded - DSP (Digital Signal Processors)MSC8101M1375F
MSC8101M1375F Image
Imaj ka reprezantasyon.
wè espesifikasyon pou detay pwodwi.
EKSPRIME OPSYON
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MSC8101M1375F - NXP USA Inc.

Manifakti Nimewo Pati
MSC8101M1375F
Manifakti
NXP Semiconductors
Allelco Nimewo Pati
32D-MSC8101M1375F
ECAD modèl
Pati Deskripsyon
DSP 16BIT 275MHZ CPM 332FCBGA
Pake
332-BFBGA, FCBGA
Done fèy
MSC8101 Fact Sheet.pdf
MSC8101 Prod Brief.pdf
Sètifikasyon nou an
Nan stok: 9030

Jaden obligatwa yo endike pa yon asterisk (*)
Tanpri voye RFQ, nou pral reponn imedyatman.

Kantite
EKSPRIME OPSYON
Metòd Peman
Sètifikasyon nou an

Espesifikasyon

Espesifikasyon MSC8101M1375F Tech
NXP USA Inc. - MSC8101M1375F espesifikasyon teknik, atribi, paramèt ak pati ki gen espesifikasyon menm jan ak NXP USA Inc. - MSC8101M1375F

Pwodwi atribi Valè atribi  
Manifakti NXP Semiconductors  
Voltage - I / O 3.30V  
Voltage - Nwayo 1.60V  
Kalite SC140 Core  
Founisè Aparèy pake 332-FCBGA (17x17)  
Seri StarCore  
Pake / Ka 332-BFBGA, FCBGA  
Pakèt Tray  
Pwodwi atribi Valè atribi  
Operating Tanperati -40°C ~ 105°C (TJ)  
Sou-Chip RAM 512kB  
Ki pa Peye-Volatile memwa External  
Mounting Kalite Surface Mount  
Entèfas Communications Processor Module (CPM)  
Clock revèy 275MHz  
Nimewo pwodwi baz MSC81  

Anviwònman & ekspòtasyon klasifikasyon

ATRIBI DESKRIPSYON
RoHs Status RoHS ki pa konfòme
Nivo sansiblite imidite (MSL) 3 (168 Hours)
Rive nan estati REACH Unaffected
ECCN 3A001A3
HTSUS 8542.31.0001

Pati ki gen espesifikasyon menm jan an

Twa pati ki sou bò dwat la gen menm espesifikasyon pou NXP USA Inc. MSC8101M1375F.

Pwodwi atribi MSC8101M1375F MSC8103M1200F MSC8101M1250F MSC8122MP8000
Nimewo Pati MSC8101M1375F MSC8103M1200F MSC8101M1250F MSC8122MP8000
Manifakti NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc.
Operating Tanperati -40°C ~ 105°C (TJ) -40°C ~ 75°C (TJ) -40°C ~ 105°C (TJ) 0°C ~ 90°C (TJ)
Entèfas Communications Processor Module (CPM) Communications Processor Module (CPM) Communications Processor Module (CPM) DSI, Ethernet, RS-232
Nimewo pwodwi baz MSC81 MSC81 MSC81 MSC81
Voltage - Nwayo 1.60V 1.60V 1.60V 1.20V
Founisè Aparèy pake 332-FCBGA (17x17) 332-FCBGA (17x17) 332-FCBGA (17x17) 431-FCPBGA (20x20)
Mounting Kalite Surface Mount Surface Mount Surface Mount Surface Mount
Clock revèy 275MHz 300MHz 250MHz 500MHz
Pake / Ka 332-BFBGA, FCBGA 332-BFBGA, FCBGA 332-BFBGA, FCBGA 431-BFBGA, FCBGA
Pakèt Tray Tray Box Tray
Seri StarCore StarCore StarCore StarCore
Ki pa Peye-Volatile memwa External External External External
Sou-Chip RAM 512kB 512kB 512kB 1.436MB
Voltage - I / O 3.30V 3.30V 3.30V 3.30V
Kalite SC140 Core SC140 Core SC140 Core SC140 Core

MSC8101M1375F fich PDF

Download MSC8101M1375F PDF fich ak dokiman NXP USA Inc. pou MSC8101M1375F - NXP USA Inc..

PCN anbalaj
2.73KHz.pdf
Enfòmasyon sou anviwònman an
NXP USA Inc REACH.pdf NXP USA Inc RoHS Cert.pdf
Html fich
MSC8101 Fact Sheet.pdf MSC8101 Prod Brief.pdf

Shipment

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  1. Telefòn
    +00852 9146 4856

Sètifikasyon & Manm

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MSC8101M1375F Image

MSC8101M1375F

NXP USA Inc.
32D-MSC8101M1375F

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