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KayPwodwi yoSikit entegre Integrated (ICs)Embedded - DSP (Digital Signal Processors)MSC8101VT1375F
MSC8101VT1375F Image
Imaj ka reprezantasyon.
wè espesifikasyon pou detay pwodwi.
EKSPRIME OPSYON
Metòd Peman

MSC8101VT1375F - NXP USA Inc.

Manifakti Nimewo Pati
MSC8101VT1375F
Manifakti
NXP Semiconductors
Allelco Nimewo Pati
32D-MSC8101VT1375F
ECAD modèl
Pati Deskripsyon
IC DSP 16BIT 250MHZ 332FCBGA
Pake
332-BFBGA, FCBGA
Done fèy
MSC8101.pdf
RoHs Status
Sètifikasyon nou an
Nan stok: 17140

Jaden obligatwa yo endike pa yon asterisk (*)
Tanpri voye RFQ, nou pral reponn imedyatman.

Kantite
EKSPRIME OPSYON
Metòd Peman
Sètifikasyon nou an

Espesifikasyon

Espesifikasyon MSC8101VT1375F Tech
NXP USA Inc. - MSC8101VT1375F espesifikasyon teknik, atribi, paramèt ak pati ki gen espesifikasyon menm jan ak NXP USA Inc. - MSC8101VT1375F

Pwodwi atribi Valè atribi  
Manifakti NXP Semiconductors  
Voltage - I / O 3.30V  
Voltage - Nwayo 1.60V  
Kalite SC140 Core  
Founisè Aparèy pake 332-FCBGA (17x17)  
Seri StarCore  
Pake / Ka 332-BFBGA, FCBGA  
Pakèt Tray  
Pwodwi atribi Valè atribi  
Operating Tanperati -40°C ~ 105°C (TJ)  
Sou-Chip RAM 512kB  
Ki pa Peye-Volatile memwa External  
Mounting Kalite Surface Mount  
Entèfas Communications Processor Module (CPM)  
Clock revèy 275MHz  
Nimewo pwodwi baz MSC81  

Anviwònman & ekspòtasyon klasifikasyon

ATRIBI DESKRIPSYON
RoHs Status
Nivo sansiblite imidite (MSL) 3 (168 Hours)
Rive nan estati REACH Unaffected
ECCN 3A001A3
HTSUS 8542.31.0001

Pati ki gen espesifikasyon menm jan an

Twa pati ki sou bò dwat la gen menm espesifikasyon pou NXP USA Inc. MSC8101VT1375F.

Pwodwi atribi MSC8101VT1375F MSC8103M1200F MSC8103M1100F MSC8122MP8000
Nimewo Pati MSC8101VT1375F MSC8103M1200F MSC8103M1100F MSC8122MP8000
Manifakti NXP USA Inc. NXP USA Inc. Freescale Semiconductor NXP USA Inc.
Voltage - Nwayo 1.60V 1.60V 1.60V 1.20V
Clock revèy 275MHz 300MHz 275MHz 500MHz
Operating Tanperati -40°C ~ 105°C (TJ) -40°C ~ 75°C (TJ) -40°C ~ 105°C (TJ) 0°C ~ 90°C (TJ)
Sou-Chip RAM 512kB 512kB 512kB 1.436MB
Seri StarCore StarCore StarCore StarCore
Ki pa Peye-Volatile memwa External External External External
Nimewo pwodwi baz MSC81 MSC81 MSC81 MSC81
Pake / Ka 332-BFBGA, FCBGA 332-BFBGA, FCBGA 332-BFBGA, FCBGA 431-BFBGA, FCBGA
Kalite SC140 Core SC140 Core SC140 Core SC140 Core
Entèfas Communications Processor Module (CPM) Communications Processor Module (CPM) Communications Processor Module (CPM) DSI, Ethernet, RS-232
Founisè Aparèy pake 332-FCBGA (17x17) 332-FCBGA (17x17) 332-FCBGA (17x17) 431-FCPBGA (20x20)
Pakèt Tray Tray Bulk Tray
Mounting Kalite Surface Mount Surface Mount Surface Mount Surface Mount
Voltage - I / O 3.30V 3.30V 3.30V 3.30V

MSC8101VT1375F fich PDF

Download MSC8101VT1375F PDF fich ak dokiman NXP USA Inc. pou MSC8101VT1375F - NXP USA Inc..

PCN anbalaj
All Dev Label Update 15/Dec/2020.pdf
Enfòmasyon sou anviwònman an
NXP USA Inc REACH.pdf NXP USA Inc RoHS Cert.pdf
Fich
MSC8101.pdf

Shipment

Tan livrezon

Nan-stock atik yo ka anbake nan lespas 24 èdtan.Gen kèk pati ki pral ranje pou livrezon nan 1-2 jou soti nan dat la tout atik rive nan depo nou yo.Ak Allelco bato lòd yon fwa nan yon jounen nan sou 17:00, eksepte Dimanch.Yon fwa byen yo ap anbake, tan an livrezon estime depann sou metòd yo anbake ak destinasyon livrezon.Tablo ki anba a montre yo se tan an lojistik pou kèk peyi komen.

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Metòd livrezon

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Japon 4
Mwayennorian Pèp Izrayèl la 6
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2.00kg-3.00kg USD $ 50.00 - USD $ 100.00
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  1. Telefòn
    +00852 9146 4856

Sètifikasyon & Manm

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MSC8101VT1375F Image

MSC8101VT1375F

NXP USA Inc.
32D-MSC8101VT1375F

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