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KayPwodwi yoSikit entegre Integrated (ICs)Embedded - Sistèm sou Chip (SoC)A2F200M3F-FG256
A2F200M3F-FG256 Image
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A2F200M3F-FG256 - Microchip Technology

Manifakti Nimewo Pati
A2F200M3F-FG256
Manifakti
Microchip Technology
Allelco Nimewo Pati
32D-A2F200M3F-FG256
ECAD modèl
Pati Deskripsyon
IC SOC CORTEX-M3 80MHZ 256FBGA
Pake
256-LBGA
Done fèy
SmartFusion cSoC Datasheet.pdf
Sètifikasyon nou an
Nan stok: 14330

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Espesifikasyon

Espesifikasyon A2F200M3F-FG256 Tech
Microchip Technology - A2F200M3F-FG256 espesifikasyon teknik, atribi, paramèt ak pati ki gen espesifikasyon menm jan ak Microchip Technology - A2F200M3F-FG256

Pwodwi atribi Valè atribi  
Manifakti Microchip Technology  
Founisè Aparèy pake 256-FPBGA (17x17)  
Vitès 80MHz  
Seri SmartFusion®  
RAM gwosè 64KB  
Prensipal atribi ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops  
Periferik DMA, POR, WDT  
Pake / Ka 256-LBGA  
Pwodwi atribi Valè atribi  
Pakèt Tray  
Operating Tanperati 0°C ~ 85°C (TJ)  
Kantite I / O MCU - 25, FPGA - 66  
Flash Size 256KB  
Nwayo Processor ARM® Cortex®-M3  
Koneksyon EBI/EMI, Ethernet, I²C, SPI, UART/USART  
Nimewo pwodwi baz A2F200  
Achitekti MCU, FPGA  

Anviwònman & ekspòtasyon klasifikasyon

ATRIBI DESKRIPSYON
RoHs Status RoHS ki pa konfòme
Nivo sansiblite imidite (MSL) 3 (168 Hours)
Rive nan estati REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001

Pati ki gen espesifikasyon menm jan an

Twa pati ki sou bò dwat la gen menm espesifikasyon pou Microchip Technology A2F200M3F-FG256.

Pwodwi atribi A2F200M3F-FG256 A2F500M3G-1CSG288I A2F200M3F-1FG484I A2F200M3F-PQ208I
Nimewo Pati A2F200M3F-FG256 A2F500M3G-1CSG288I A2F200M3F-1FG484I A2F200M3F-PQ208I
Manifakti Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Koneksyon EBI/EMI, Ethernet, I²C, SPI, UART/USART EBI/EMI, Ethernet, I²C, SPI, UART/USART EBI/EMI, Ethernet, I²C, SPI, UART/USART EBI/EMI, Ethernet, I²C, SPI, UART/USART
RAM gwosè 64KB 64KB 64KB 64KB
Nwayo Processor ARM® Cortex®-M3 ARM® Cortex®-M3 ARM® Cortex®-M3 ARM® Cortex®-M3
Kantite I / O MCU - 25, FPGA - 66 MCU - 31, FPGA - 78 MCU - 41, FPGA - 94 MCU - 22, FPGA - 66
Pakèt Tray Tray Tray Tray
Pake / Ka 256-LBGA 288-TFBGA, CSPBGA 484-BGA 208-BFQFP
Periferik DMA, POR, WDT DMA, POR, WDT DMA, POR, WDT DMA, POR, WDT
Vitès 80MHz 100MHz 100MHz 80MHz
Nimewo pwodwi baz A2F200 A2F500 A2F200 A2F200
Operating Tanperati 0°C ~ 85°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ)
Founisè Aparèy pake 256-FPBGA (17x17) 288-CSP (11x11) 484-FPBGA (23x23) 208-PQFP (28x28)
Achitekti MCU, FPGA MCU, FPGA MCU, FPGA MCU, FPGA
Seri SmartFusion® SmartFusion® SmartFusion® SmartFusion®
Flash Size 256KB 512KB 256KB 256KB
Prensipal atribi ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

A2F200M3F-FG256 fich PDF

Download A2F200M3F-FG256 PDF fich ak dokiman Microchip Technology pou A2F200M3F-FG256 - Microchip Technology.

PCN Lòt
2.73KHz.pdf
PCN konsepsyon/spesifikasyon
Mult Dev Design Advisory 13/Oct/2017.pdf Mult Dev Software Chg 8/Oct/2018.pdf
PCN pati estati chanjman
Mult Devices 19/Jun/2017.pdf
Asanble PCN/orijin
2.73KHz.pdf
Html fich
SmartFusion cSoC Datasheet.pdf

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