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KayPwodwi yoSikit entegre Integrated (ICs)Embedded - Sistèm sou Chip (SoC)A2F060M3E-FGG256
A2F060M3E-FGG256 Image
Imaj ka reprezantasyon.
wè espesifikasyon pou detay pwodwi.

A2F060M3E-FGG256 - Microsemi Corporation

Manifakti Nimewo Pati
A2F060M3E-FGG256
Manifakti
Microsemi
Allelco Nimewo Pati
32D-A2F060M3E-FGG256
ECAD modèl
Pati Deskripsyon
IC SOC CORTEX-M3 80MHZ 256FBGA
Deskripsyon detaye
Pake
256-LBGA
Done fèy
SmartFusion cSoC Datasheet.pdf
Nan stok: 10320

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Kantite

Espesifikasyon

Espesifikasyon A2F060M3E-FGG256 Tech
Microsemi Corporation - A2F060M3E-FGG256 espesifikasyon teknik, atribi, paramèt ak pati ki gen espesifikasyon menm jan ak Microsemi Corporation - A2F060M3E-FGG256

Pwodwi atribi Valè atribi  
Manifakti Microsemi  
Founisè Aparèy pake 256-FPBGA (17x17)  
Vitès 80MHz  
Seri SmartFusion®  
RAM gwosè 16KB  
Prensipal atribi ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops  
Periferik DMA, POR, WDT  
Pake / Ka 256-LBGA  
Pwodwi atribi Valè atribi  
Pakèt Tray  
Operating Tanperati 0°C ~ 85°C (TJ)  
Kantite I / O MCU - 26, FPGA - 66  
Flash Size 128KB  
Nwayo Processor ARM® Cortex®-M3  
Koneksyon EBI/EMI, I²C, SPI, UART/USART  
Nimewo pwodwi baz A2F060M3E  
Achitekti MCU, FPGA  

Pati ki gen espesifikasyon menm jan an

Twa pati ki sou bò dwat la gen menm espesifikasyon pou Microsemi Corporation A2F060M3E-FGG256.

Pwodwi atribi A2F060M3E-FGG256 A2F200M3F-1FGG484I A2F200M3F-FGG256I A2F200M3F-FG256I
Nimewo Pati A2F060M3E-FGG256 A2F200M3F-1FGG484I A2F200M3F-FGG256I A2F200M3F-FG256I
Manifakti Microsemi Corporation Microchip Technology Microchip Technology Microchip Technology
Nwayo Processor ARM® Cortex®-M3 ARM® Cortex®-M3 ARM® Cortex®-M3 ARM® Cortex®-M3
Pakèt Tray Tray Tray Tray
Periferik DMA, POR, WDT DMA, POR, WDT DMA, POR, WDT DMA, POR, WDT
Flash Size 128KB 256KB 256KB 256KB
Prensipal atribi ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
RAM gwosè 16KB 64KB 64KB 64KB
Seri SmartFusion® SmartFusion® SmartFusion® SmartFusion®
Vitès 80MHz 100MHz 80MHz 80MHz
Koneksyon EBI/EMI, I²C, SPI, UART/USART EBI/EMI, Ethernet, I²C, SPI, UART/USART EBI/EMI, Ethernet, I²C, SPI, UART/USART EBI/EMI, Ethernet, I²C, SPI, UART/USART
Founisè Aparèy pake 256-FPBGA (17x17) 484-FPBGA (23x23) 256-FPBGA (17x17) 256-FPBGA (17x17)
Achitekti MCU, FPGA MCU, FPGA MCU, FPGA MCU, FPGA
Kantite I / O MCU - 26, FPGA - 66 MCU - 41, FPGA - 94 MCU - 25, FPGA - 66 MCU - 25, FPGA - 66
Pake / Ka 256-LBGA 484-BGA 256-LBGA 256-LBGA
Operating Tanperati 0°C ~ 85°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ)
Nimewo pwodwi baz A2F060M3E A2F200 A2F200 A2F200

A2F060M3E-FGG256 fich PDF

Download A2F060M3E-FGG256 PDF fich ak dokiman Microsemi Corporation pou A2F060M3E-FGG256 - Microsemi Corporation.

PCN konsepsyon/spesifikasyon
Mult Dev Design Advisory 13/Oct/2017.pdf A2FYYY 07/Nov/2016.pdf
PCN Lòt
Logistics 16/Nov/2016.pdf
PCN obsolescence/ eol
EOL Notice 04/Apr/2017.pdf Mult Devices 04/Apr/2017.pdf
Asanble PCN/orijin
Mult Dev Test Site 28/Feb/2019.pdf
Fich
SmartFusion cSoC Datasheet.pdf

Shipment

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A2F060M3E-FGG256

Microsemi Corporation
32D-A2F060M3E-FGG256

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